如題: + u, S4 e9 G( M& I* W8 X( c/ d各位大大們: * `5 p! u, S M* k- ?& j4 ~2 Q0 }請教一下 Number of bonded IOBs: 563 out of 440 127% (*) / P4 G! w0 j9 R, A1 `我的IOB超出範圍出現以下錯誤..該如何解決啊??+ v; V5 r8 s! ^' o+ w' Z; G
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ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. & `. [; @. O9 U9 e) W- z + Z; c( i$ ]$ |3 d; [; }+ e9 zERROR:Map:115 - The design is too large to fit the device. Please check the 0 V: G* K1 J H: t% l+ w/ s Design Summary section to see which resource requirement for your design _- J4 C$ {' P9 A0 i
exceeds the resources available in the device. In particular check the3 w2 M0 o `4 g! p
non-slice resources since the slice counts may reflect the early termination $ E2 }7 o4 Z: G- F of the flow.9 c" |0 l. r& @ u5 K- _- K# Q9 \
4 l1 g L( }2 C NOTE: An NCD file will still be generated to allow you to examine the mapped " u8 G; Y. m5 H! @" G& p8 D design. This file is intended for evaluation use only, and will not process ( K8 b3 S5 G9 P0 e2 w successfully through PAR. ) O" ?% f0 G6 @/ k/ P! Q' b% M4 s V' J* l) o2 l# A H
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device. * E5 [9 ^8 H7 l* ^% T0 l: z( y0 J0 {8 S9 r% C3 K
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