ISE的問題...請教前輩們

mclaren_18

   如題:
) Z1 x% w' t0 t# |% c6 G$ W各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
! \' b9 E7 W* j* F# ]我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

ERROR:Map:115 - The design is too large to fit the device.  Please check the
$ i$ P/ N* O# U  i5 E3 s' y   Design Summary section to see which resource requirement for your design
. E2 R! H: k! u+ u  L   exceeds the resources available in the device.  In particular check the
9 w: j& k; u! N3 h   non-slice resources since the slice counts may reflect the early termination
/ `4 s# z% `2 q) C. j4 G7 T   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.
* @0 D9 I! z" A0 C5 t1 e5 e8 x: X1 e
5 i, s8 \5 {# y& D/ w+ c; sERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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& V' f0 z. N8 B1 C$ N3 c謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!