ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
( q$ g) F: B" E% P, y9 W" L我的IOB超出範圍出現以下錯誤..該如何解決啊??

& S$ }* I  L: M% s' ZERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

+ A/ E/ a8 B8 s1 B8 k( TERROR:Map:115 - The design is too large to fit the device.  Please check the
5 q2 J; \! [  r0 ^4 M4 [2 S$ p   Design Summary section to see which resource requirement for your design
5 E2 s2 c( f1 \1 c   exceeds the resources available in the device.  In particular check the
$ L1 k4 `) S* v5 w! Z* u   non-slice resources since the slice counts may reflect the early termination
" E; F% M- P, v   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
& \" Z; c5 S+ O& Q3 h   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.

) x' C4 \" z* o3 F, S: EERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
4 V: P1 S/ n' L& ~1 }; a4 P
+ {9 c& {4 x2 \" S7 w, B7 \謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!