ISE的問題...請教前輩們

mclaren_18

   如題:
6 P2 B# I. o+ J9 Y  A; n各位大大們:
: q' q$ Q  w3 X5 X) Q9 b請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
3 X7 S* m$ ^# t8 D- ^我的IOB超出範圍出現以下錯誤..該如何解決啊??

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
5 \1 q8 W- a9 S' ~; I( i# `
ERROR:Map:115 - The design is too large to fit the device.  Please check the
   Design Summary section to see which resource requirement for your design
4 |- o% a# i3 S) o   exceeds the resources available in the device.  In particular check the
   non-slice resources since the slice counts may reflect the early termination
   of the flow.

* G: w) `. B) O1 t1 m; J   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
   successfully through PAR.

ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
3 K1 w% ?) }3 ~! l; J! v$ U+ G
謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
! h1 A1 {* i) M; ]6 s- t5 ^" b換較大的 package or 減少 IO 使用數量!