某半導體大廠徵求Technical Manager

chip123

Title Responsibilities：

1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
! O$ F8 F# Z) s' K: Z2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
3. Planning, setting priority, and exeution of short and long term tasks.       
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# z4 g/ T, s) T0 k) TRequirements：

! x, v+ b: W# _- p( _1. Minimum master degree in engineering field
6 O. W4 a! K1 J  ~2. Minimum 5 years of experiences in process integration or device engineering.
, a9 F; j3 B2 J1 z# l2 w3. Candidate with design or product experience is a plus
0 T/ m1 w2 [0 Q: H. u4. Fluent in English.
5. Work location in Hsinchu, Taiwan."
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7 q( L4 D0 D) n8 Q. F2 sPackage： around annual NT 300萬 ~700萬
$ x# }0 ?( b% D) h3 a. C2 r
Stock： providing stock option depends on experience

6 J" E6 q, B* `# z, V- j意者請與 chip123@chip123.com.tw  聯絡！