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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead
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3 n/ j. v. j" ]. f2 O公      司:One world top EDA company+ z  q& c8 \1 j; G
工作地点:上海
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Position Description:  
, j. c1 z  o3 p6 i7 S. ~+ b1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. % _& [- l, D$ W8 _

6 p. X. e2 i9 M) [/ H2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers:
' A% [0 R. P6 b+ x0 q. {" p(1) xx  Palladium HW Acceleration Platforms
! W7 r& o. t% C$ H; M& o; m(2) xx Acceleratable Verification IP portfolio & y& O$ o' ^  M- X/ A! P
(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis
% Q& `* F9 l- A7 \# W( B' u7 d(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  
) Y$ L7 k& Y4 }$ _0 p- o# M8 |1. Experience:  6 e) w# }' e# C; Y
- Minimum experience required: 10 years  + u1 }4 B$ D6 @
- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.
1 q) u7 X: C3 u( c( {8 E* \; q0 z- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.' Q6 t# E+ n2 C( _- R
- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired ! C9 g; I, m& S* M
- Strong verbal and written communication skills in English are required  
% i% B8 Q+ K8 F- J9 [- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must
7 v$ Y: V  f6 @# H: b. ?9 |- Hardware verification, including knowledge of HDL simulators and debugging simulations , i  i2 t# L, K/ G
- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.: o! e5 f* E  k( }( R3 }
- Knowledge of embedded systems and software development for SoCs is a plus
: A3 e$ I* }: B% r6 r5 ?) F2. Education:  . L  y' p( R0 F. S1 e  g) M
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  3 p8 o' X1 g& h) z/ b6 a
- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience). $ G& b3 q  g' f% u
3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer
3 B- Y# ~/ r+ ]# W- I0 E/ _" ]公      司:A famous IC company
9 c/ l( \' a- @) M6 I* _工作地点:南京
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5 T! D# B. ?' k$ ]; lKey Responsibilities  6 t- A3 T' n4 [: i
Depending on experience, key responsibilities will involve some of the following:  / `& [2 I0 }5 M4 \+ j
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
$ n" l( Y  U& gAs a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
% b3 @2 D! p* ~* \Leading a team of physical design engineers and resolving the technical related issues.  
! V& `& C7 J; [. E/ P+ Y9 X; dCrosstalk analysis, power analysis, and static timing analysis.  
+ Q/ r4 e3 V" |+ E0 sWrite scripts in Tcl to improve productivity.  
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: C5 g% ]- Q8 h4 a8 x职位要求& q. I) H) i! ?; q
Experience: 5+ years in physical implementation engineering   
1 v; ^0 W5 M6 }9 H. M$ P) {Essential skills  & x# u0 G6 y$ h
MS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  
# P% t0 O& o" t8 g: J2 SExperience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
2 V$ g' s( K6 ^7 hGood programming skill. Capable of writing Tcl or Perl.  & \+ x" [/ J9 ?7 i
Familiar with synthesis, static timing analysis.  
8 }6 s! m) Z$ U0 [# u9 OSelf-motivated team worker, good verbal and written communication skills in English.  5 f3 Z# R% g2 Y4 g% E& w
Technical and team leadership proffered. Previous management experience highly desired.  # A( g* B; `/ c5 u0 J9 t1 _
Experience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
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俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。
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2 ~- L+ `8 l9 t& d# c' [TSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」 8 n6 `3 g6 ]& R$ t8 J
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Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。
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兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。 , Z8 u; a* k. D6 c0 ]6 b

' {6 @4 e* h4 n( {# @, I為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。 / R* N; o- f0 ^0 p) z" H6 m

: c) |+ D! d2 G: x) e因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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