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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead
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* u: p/ U4 r  w! B公      司:One world top EDA company
! H4 ~9 y6 V, C$ U/ E1 f4 l3 h* W3 R工作地点:上海
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: x/ K% H. _  b  l: Z0 _  O' Z: fPosition Description:  
) \& |/ u- {; n8 p1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. ) B- q# \, _# _( i2 S

( l1 v, a! l  w# _# }4 R2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers: " R* X2 y( n4 w( A* ?2 N
(1) xx  Palladium HW Acceleration Platforms   Q) o! M+ x7 o7 z: ~3 o5 P+ H
(2) xx Acceleratable Verification IP portfolio : ?  _/ B6 j2 [  y' O; O4 L
(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis( T* ]  e3 D0 k4 \8 ?% J
(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  
6 h4 N  k4 Q' o1. Experience:  
' V, t1 W; W9 }6 D# G- Minimum experience required: 10 years  
6 {1 V* ~7 m$ y. A  A& b" c) `6 L- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.
% t7 w& b2 \9 @0 c( F- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.
1 O! O/ h" c, c( y( n9 E' s1 d- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
" a3 }" Z' t* Z/ v+ {! e- Strong verbal and written communication skills in English are required  % [  K! X7 b$ Q
- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must 8 ^# a3 V5 I! e. }( i
- Hardware verification, including knowledge of HDL simulators and debugging simulations
0 ~( v9 X6 g, ^% d2 [* L: p" Z' h. Q9 H- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.
4 u: W8 H3 X* R9 O8 `- r- Knowledge of embedded systems and software development for SoCs is a plus
) b0 O8 ?! J( x- f5 k4 Y2. Education:  5 H) a3 W7 ~' r9 \5 s% L9 F. ?
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  
5 v* O, K& c3 m3 k; o0 Y- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience).
8 {# s/ s( b$ ]0 ]5 E7 u! p! [3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer. h2 ]% j( C  Q8 o+ u+ I  \4 @
公      司:A famous IC company+ c$ Y& S% U* P0 t( N3 a# t
工作地点:南京: Z8 U' l+ ?+ [5 k1 D" C# ?

7 W% o& R0 e! k/ z' S  D* {- tKey Responsibilities  4 e) x3 {% t& u8 h- g9 W$ ^! U
Depending on experience, key responsibilities will involve some of the following:  
5 V/ @" s! }' z, S1 Y8 n; PIC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
7 y' w1 }- |  ZAs a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
4 H" I, @& U0 H* t. O; ^4 cLeading a team of physical design engineers and resolving the technical related issues.  $ `1 }& A+ e7 E" w
Crosstalk analysis, power analysis, and static timing analysis.  
0 \+ Y8 P( E( L+ ?: iWrite scripts in Tcl to improve productivity.  " o1 l$ E5 q% V" o& v  v
) v* ^; ]5 q" H$ h0 N/ I& o0 Z. S# ]% ~
职位要求* A  p# x* P; s& e% \0 ^+ u
Experience: 5+ years in physical implementation engineering    8 ?& {- {8 h+ y; g  `- Y1 M/ b) x1 \
Essential skills  
8 l$ T! i: j, \( j7 ~: nMS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  ( i5 Y7 @2 ]0 W4 \
Experience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
3 N/ }, ]% r$ |( YGood programming skill. Capable of writing Tcl or Perl.  
: d2 f8 C7 K) MFamiliar with synthesis, static timing analysis.  # `& G8 x* ~3 R" @
Self-motivated team worker, good verbal and written communication skills in English.  9 r( z# ?5 ~6 D- q: i
Technical and team leadership proffered. Previous management experience highly desired.  
/ @# ~  `. P2 R' t2 s3 c: |# HExperience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
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4 ~! j3 D& C. g) P9 `* ^7 I 俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 ! [, _" `" U% {1 k
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TSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」 ' b+ {- G& x8 @" m" E
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Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。 / _* Q- P/ w$ E4 `+ g1 F

$ y3 z* L8 j5 O9 {+ t0 `' {! u兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。 - o% S8 o- T( U

, v& C" @5 v/ E& @$ d, j為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。
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( _( i2 a) g) J  }" q9 H因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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