外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

highspeeddesign

美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
3 P; Y7 X5 o$ @# A請發送履曆或者您的問題到lowpowerdesign@hotmail.com，爲您一一解答

/ t# ]0 Q% L& N5 F- nBased in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
& z8 D% ^6 _7 m4 R5 g4 X, Gpartners in fast growing ASIA operation team
# l* Q% ^  |- s! x* s  cAssembly and Bumping engineering and operational management include:
- New package and product characterization, qualification and implementation.
. ^$ t9 F/ h4 `: q! K, Z- Packaging process improvement, alternative material and cost reduction.
- Excursion and operation performance improvement.
, S' M6 [5 e' {  g: |& i- Cross-organization functional coordination between package development, product
engineering, supply chain, quality and subcontractors
, g/ b6 m+ B+ ]3 M7 P$ qRequirements/Qualifications (Education)
- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
- 10+ year hands on experience in assembly and bumping operation
- Oversea management experience on direct OSAT subcontractors and system level
customers
$ v) \- G" ]* {- Self motivated with strong work ethics
" S8 N  i- I' `' K- E; g- Excellent negotiation skills
' H5 x- O' ~4 b/ d- Excellent communication skills in both Chinese and English
- Project management, DOE, 6Sigma.