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Abstract -- The diode operated in forward-biased condition has
# t! r& W+ x2 ?3 n) L5 {8 z0 _been widely used as an effective on-chip ESD protection device at- [$ U1 d0 V1 N
GHz RF and high-speed I/O pads due to the small parasitic k& q% K8 i" z+ F) ~
loading effect and high ESD robustness in CMOS integrated
2 _/ u# d. T+ X- s1 zcircuits (ICs). This work presents new ESD protection diodes! v' P1 U, |; T( Y9 p9 {! O
realized in the octagon, waffle-hollow, and octagon-hollow layout" j7 H4 Z% r2 b& L
styles to improve the efficiency of ESD current distribution and+ j& l" p; o! K' [
to reduce the parasitic capacitance. The new ESD protection2 e2 W5 P. s) G5 v* r' ~" `( |* X* M
diodes can achieve smaller parasitic capacitance under the same
$ D1 L* @! I- a* `: v; tESD robustness level as compared to the waffle diode. Therefore,% B7 D3 Q8 t, W8 O
the signal degradation of GHz RF and high-speed transmission$ N n2 q' p4 m6 m1 t. P
can be reduced due to smaller parasitic capacitance from the new' Q" f( m1 _2 Y; \, V( g; V8 ]# q( B+ x
proposed diodes. |
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