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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has0 f! l6 I \6 a' y' T
been widely used as an effective on-chip ESD protection device at4 ?& B( z1 i% v- w& t
GHz RF and high-speed I/O pads due to the small parasitic
, h. f1 S4 _! A" N/ tloading effect and high ESD robustness in CMOS integrated
: @, b1 \% I' [& [: @6 A/ ycircuits (ICs). This work presents new ESD protection diodes
+ y) K2 j4 y) f& Y1 hrealized in the octagon, waffle-hollow, and octagon-hollow layout
4 l! F- L+ r c0 }* R0 K4 B; jstyles to improve the efficiency of ESD current distribution and
* ^+ P( w [& ]to reduce the parasitic capacitance. The new ESD protection, f1 H, A: Y6 O. s: z3 c+ c+ j9 X
diodes can achieve smaller parasitic capacitance under the same3 Y9 _8 f- t2 ^" l" W) S6 K
ESD robustness level as compared to the waffle diode. Therefore,
, a) H: F. m$ athe signal degradation of GHz RF and high-speed transmission
$ x& {6 Y( `1 j J7 `; Vcan be reduced due to smaller parasitic capacitance from the new
9 e: A6 o$ }0 g9 Gproposed diodes. |
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