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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has
2 ^+ N3 ?: J2 W! }% a) Y0 wbeen widely used as an effective on-chip ESD protection device at& O) a" P3 F* c, T- b
GHz RF and high-speed I/O pads due to the small parasitic
: r1 C8 x& t8 M; Yloading effect and high ESD robustness in CMOS integrated3 m$ N2 h1 ^2 @! f* _: r" M
circuits (ICs). This work presents new ESD protection diodes
4 ~8 @ b" O2 zrealized in the octagon, waffle-hollow, and octagon-hollow layout
2 c3 [1 q% z1 x. P3 c* Istyles to improve the efficiency of ESD current distribution and7 N- d x1 ?( x/ R, G, @
to reduce the parasitic capacitance. The new ESD protection
" y7 b+ T2 V5 b% K. T( Xdiodes can achieve smaller parasitic capacitance under the same
& x& N" l8 S) Q# C: N" q& nESD robustness level as compared to the waffle diode. Therefore,
' h- A7 W8 A& `) g9 v# m' V8 Athe signal degradation of GHz RF and high-speed transmission+ Z3 R- `, `& \& a' _; |4 R' C% ]
can be reduced due to smaller parasitic capacitance from the new: g7 R) a* A0 D2 }* a+ t$ q
proposed diodes. |
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