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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has0 F3 j: D8 d5 w1 w w* z# V1 I
been widely used as an effective on-chip ESD protection device at
2 j! [; h8 N+ m8 R* DGHz RF and high-speed I/O pads due to the small parasitic
& O" z* Z$ `( {' {& p+ Qloading effect and high ESD robustness in CMOS integrated- r- y+ o' i1 ^1 B6 S7 g% W+ O
circuits (ICs). This work presents new ESD protection diodes* z3 U9 T+ U+ |8 t. W! f8 t8 C
realized in the octagon, waffle-hollow, and octagon-hollow layout
4 b Y) D' F% T, p7 H! estyles to improve the efficiency of ESD current distribution and
2 U5 p! f) v0 s( ^7 Uto reduce the parasitic capacitance. The new ESD protection
5 m' v; r! n9 h8 ]. v f+ Tdiodes can achieve smaller parasitic capacitance under the same4 @5 ^/ ?8 I1 ]
ESD robustness level as compared to the waffle diode. Therefore,; C, P: i+ k/ @
the signal degradation of GHz RF and high-speed transmission3 C, x) |% \3 N( }. P
can be reduced due to smaller parasitic capacitance from the new
- o. T- L4 Z' A5 U! O4 Dproposed diodes. |
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