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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has* w- `0 c% r4 [3 y, Z/ T C
been widely used as an effective on-chip ESD protection device at2 K9 c2 i8 B% I
GHz RF and high-speed I/O pads due to the small parasitic, X2 A: N0 Q" M% n" ^5 b7 L
loading effect and high ESD robustness in CMOS integrated0 G% o0 i4 Y' N0 T8 m5 E
circuits (ICs). This work presents new ESD protection diodes7 N! H* Z5 h) c/ X% J4 ?5 j+ g
realized in the octagon, waffle-hollow, and octagon-hollow layout9 [8 O7 W- c# ]" n/ W9 ]2 Z
styles to improve the efficiency of ESD current distribution and+ Q8 ? K9 _7 n" f( V+ C* f
to reduce the parasitic capacitance. The new ESD protection6 W7 J7 e6 A/ Q% v5 Y) m
diodes can achieve smaller parasitic capacitance under the same8 J* i0 c8 \8 r! s
ESD robustness level as compared to the waffle diode. Therefore,9 G( V+ g5 I6 S
the signal degradation of GHz RF and high-speed transmission
5 d- P& F; O9 o& U Q0 scan be reduced due to smaller parasitic capacitance from the new# i5 @: Z" S; x/ M' {5 {
proposed diodes. |
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