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Layout Guidelines for Optimized ESD Protection Diodes/ h* l5 @6 D3 S P9 c
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Karan Bhatia and Elyse Rosenbaum
r6 L* s9 U5 KDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
- l) B, X9 w% K* \- G4 U4 n9 O: M1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu0 q' H- V d9 D3 K& V' T
- R$ b# s; P/ j( P6 a2 h6 h. MAbstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are2 D- D. J) i2 e7 }4 F. Y
investigated. The current compression point (ICP) is introduced to define the maximum current handling
# C! @0 _% @; `3 e. e# T# {capability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the
& ~3 }' A# l$ ^* bperformance of the structures investigated herein. |
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