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Layout Guidelines for Optimized ESD Protection Diodes; P2 X! K5 s8 p
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Karan Bhatia and Elyse Rosenbaum2 v ]" a7 _7 M
Department of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign$ ^1 H- Q4 E6 n' B, r: l
1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
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Abstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are4 Y, d) {) ~" ?* E8 h
investigated. The current compression point (ICP) is introduced to define the maximum current handling
2 U g8 }9 }- b! _$ n7 l8 ncapability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the- l$ q% |1 n G+ S3 ?
performance of the structures investigated herein. |
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