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Layout Guidelines for Optimized ESD Protection Diodes1 l, ?" Z# ^9 d# U9 l8 P: m2 B
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Karan Bhatia and Elyse Rosenbaum
! X5 C- w$ l7 h! v: ZDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
2 M% k$ U( F9 \1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
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: u; U. O& R# {! H9 M2 f( ~Abstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are
* U7 d, o# C2 k! { v, uinvestigated. The current compression point (ICP) is introduced to define the maximum current handling' l$ l9 B" c" ^. ^) u. i* `8 {
capability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the+ f" D3 ^+ U8 A. a3 S Z
performance of the structures investigated herein. |
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