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Title Responsibilities:- ]" A7 M. l& f4 C: n8 M1 m1 F
, H% C* V9 X6 R8 O1 A+ N( \1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
* L3 z2 g& ^+ i- z" `4 W2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
2 V$ ?& O1 K2 B7 E3. Planning, setting priority, and exeution of short and long term tasks.
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Requirements: z' L: a; Q- b/ e. n/ B! ^
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1. Minimum master degree in engineering field! A& b4 d5 ~, W# L5 b
2. Minimum 5 years of experiences in process integration or device engineering.
: G7 u5 x }9 ^* K& y3. Candidate with design or product experience is a plus. T2 K9 |" N% T. x4 u/ v; p5 z7 d
4. Fluent in English.
& ]) `. Y' u5 D2 Q& P& f5. Work location in Hsinchu, Taiwan."
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% C1 p0 e1 B$ O+ t% HPackage: around annual NT 300萬 ~700萬
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4 G$ w6 {; S2 ]. I* y3 [Stock: providing stock option depends on experience
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意者請與 chip123@chip123.com.tw 聯絡! |
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