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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead4 E# G( c2 R& ^4 s0 V8 u0 O5 {
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公      司:One world top EDA company% o* l1 w" o- ]$ d9 Q/ F
工作地点:上海' w: \; T" P: Z

. h5 h9 V4 ?* F+ ], P7 s2 O7 r, uPosition Description:  / b& c8 ~: |- o9 i
1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike.
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2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers: ) Q' m# f. o2 _& _
(1) xx  Palladium HW Acceleration Platforms
' g4 @0 L' L8 Y4 H2 O(2) xx Acceleratable Verification IP portfolio 4 q# B) l  }( H8 z, ~% g7 W
(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis
. x& y$ ?  {7 T(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  
3 U( k; ]8 _/ u6 d. ]5 a1. Experience:  
  C( Q6 A+ B; R1 P0 d- Minimum experience required: 10 years  
: V1 ?* n9 P) _8 M$ t7 j4 }' x) t- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.  ~: j1 X, M; F& z
- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.9 `; O( }/ u; Q$ W2 b0 G7 I$ t9 y
- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
- U4 ?, z2 Y0 ~0 j! @6 e, [& F7 ^- Strong verbal and written communication skills in English are required  9 \0 v& z% m: R: z
- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must
" u6 [; U5 d# ^+ f  I9 h& z- Hardware verification, including knowledge of HDL simulators and debugging simulations " s, a. A8 p! G; W. y0 j
- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.
' ~2 V  q, ?" z3 ]& F( Y- Knowledge of embedded systems and software development for SoCs is a plus # ~, G9 U+ T9 @% F3 v! L0 L
2. Education:  
; m' a& h) v: a  CIdeally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  0 |, {6 V: Q+ A( O- A4 r, i
- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience).
! b* z2 H9 ~& ]9 t3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer% m. w3 q& x7 N/ J: }9 W0 R
公      司:A famous IC company  l% j) A6 I0 `) G. s
工作地点:南京
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! X4 v$ G; @8 J; lKey Responsibilities  
" {2 j( Y& a, l) w. n8 G- o2 U- qDepending on experience, key responsibilities will involve some of the following:  + ?8 N# L/ q5 k3 f, Z
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification. 3 C. |# K6 M# I7 M, e+ V7 h
As a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
, [9 D+ ]+ j; ^Leading a team of physical design engineers and resolving the technical related issues.  : D, K  a# a) a7 l2 [  d
Crosstalk analysis, power analysis, and static timing analysis.  " n7 n' G  u5 ^4 p$ J. [$ T
Write scripts in Tcl to improve productivity.  
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职位要求+ L0 G$ ~# F( Z; u  \" H& N
Experience: 5+ years in physical implementation engineering    4 A- @, u0 {: ?
Essential skills  
: t/ a  t. G. {) Q  T6 L2 v4 MMS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  
+ _' x5 L( E( Q  N5 V: r* TExperience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
4 F8 s( P# H: F0 |* n; JGood programming skill. Capable of writing Tcl or Perl.  
& n6 L7 d2 h! vFamiliar with synthesis, static timing analysis.  
8 K% S# \" w4 l* @Self-motivated team worker, good verbal and written communication skills in English.  
3 m3 O2 ^. I) X  @" @* S5 F# hTechnical and team leadership proffered. Previous management experience highly desired.  ( t1 u9 E& w( E7 [$ M
Experience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
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俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 ! K  D; N' ]" P) v$ k" _

2 D! B: V% e9 t1 g! K- h, d9 M+ O+ _. gTSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」
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Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。 " Y0 D  l1 a- }( P$ R; f1 d! l9 D

$ i- c/ S7 w7 L$ @0 ?兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。
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為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。 / @, C( {, ?5 M/ _" G) c
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因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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