外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

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Based in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
- u/ `( p1 j' d. I- bpartners in fast growing ASIA operation team
Assembly and Bumping engineering and operational management include:
- New package and product characterization, qualification and implementation.
4 d2 _- m( A" X. S- Packaging process improvement, alternative material and cost reduction.
; I7 V, V) r9 ~, x# F7 Y( t- Excursion and operation performance improvement.
/ `% P: ]1 ^9 O6 U2 i  d+ p* e- Cross-organization functional coordination between package development, product
, ?- W. m) B8 X' ?engineering, supply chain, quality and subcontractors
8 K& z% h5 ~$ _' t( y1 \) w& TRequirements/Qualifications (Education)
- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
- 10+ year hands on experience in assembly and bumping operation
0 g( W4 ?& u; E: X7 k. X3 W2 Y- Oversea management experience on direct OSAT subcontractors and system level
customers
- Self motivated with strong work ethics
, N+ F' q9 i. {5 I8 T- Excellent negotiation skills
- Excellent communication skills in both Chinese and English
% a* S/ d( V$ K& _# u) f' m- Project management, DOE, 6Sigma.