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Job Description
7 N2 ?" j n1 l- Manage all test engineering activities at subcontractor test sites, drive test process. N& o2 t. V7 a2 R$ }5 z, u
standardization and improve site capabilities and capacities
) k8 Y8 E5 I p! d9 \& _1 D; o/ ^- Manage New Product Introduction to subcontractor, debug test program and hardware for: A4 L, a d( C4 A: M2 {3 }1 p
mass production
* k& J; l, d q r) X3 q- Support production in wafer sort and package test, test yield monitoring, customer return
/ _* o. v" S% x9 |1 ranalysis and quality conformance
0 f! T6 `) x7 t* @ y* g) O- Assist other team members to resolve technical issues and perform site to site correlation
8 }, d; R+ a2 ^2 Q0 [2 |( wRequirements/Qualifications (Education)
9 x3 S) ?) ]3 f( c, F' }6 ?* o- BS/MS in Electrical/Electronic Engineering or Computer Science
& A5 P8 n- L3 B4 v5 k# Y. D$ g- 6+ years of test engineering experiences in high volume production test environment and
0 N& F' I% _) l. N) Fsocket, load-board, probe card knowledge 5 Y3 [3 u0 h+ j, n7 v" m, P
- Familiar with Verigy 93K and Teradyne UltraFLEX tester platform and programming skill3 W% p: q V |) M' s( R
- Knowledge in software programming - Unix, C or Perl* y# l: o' g8 |: E) y7 R
- Able to multitask in a fast paced environment. Project management skill is a plus7 K; \) M! o ~3 |
- Aggressive attitude and excellent communications skills in both Chinese and English |
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