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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has8 h4 k- T* p9 T7 `1 k% R2 M2 R
been widely used as an effective on-chip ESD protection device at
6 s3 C+ M, N) ]1 k" h7 kGHz RF and high-speed I/O pads due to the small parasitic
& _" J3 S% z& ^; kloading effect and high ESD robustness in CMOS integrated
! Q: z" Y6 H* t: e$ L. gcircuits (ICs). This work presents new ESD protection diodes3 J8 P$ d4 l5 V, O( {5 ~' l
realized in the octagon, waffle-hollow, and octagon-hollow layout
5 f* B% o( R( [8 O) f! @* N8 zstyles to improve the efficiency of ESD current distribution and
- l+ W t6 T' a' v! h' ito reduce the parasitic capacitance. The new ESD protection# O0 P5 X0 Y1 f' y5 M/ q1 N
diodes can achieve smaller parasitic capacitance under the same
- J, j1 s% ]: Y* G- H8 M# h. DESD robustness level as compared to the waffle diode. Therefore,/ u( X5 m" {# U
the signal degradation of GHz RF and high-speed transmission
2 N3 e) a) `' y9 h$ ?can be reduced due to smaller parasitic capacitance from the new
2 b- }" Z) `, f- ]# gproposed diodes. |
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