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Layout Guidelines for Optimized ESD Protection Diodes
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Karan Bhatia and Elyse Rosenbaum
& k' m. W8 [* s2 o( b# q5 QDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
. A V6 [- R6 ?$ [. {9 o1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu( z* |3 N. x, {/ O& K
( w/ s# \- j l; |4 t6 Y3 z! VAbstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are$ @! r$ W* O: V h& r3 Q
investigated. The current compression point (ICP) is introduced to define the maximum current handling
. D9 F5 \9 s, n, {" R* b2 O2 ncapability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the
i, M& _ [; E) s5 |3 o/ [) operformance of the structures investigated herein. |
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