某半導體大廠徵求Technical Manager

chip123

Title Responsibilities：
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1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
4 Z' X4 D8 c! h5 F7 z: o2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
; k/ D$ B2 F) C! ?" O; s. `- c3. Planning, setting priority, and exeution of short and long term tasks.       

' E3 a7 s* u7 KRequirements：

( v7 d8 l# Y0 C* r  a+ v3 z1. Minimum master degree in engineering field
: x: X3 O7 o) a' g2. Minimum 5 years of experiences in process integration or device engineering.
8 t) i8 m: {( E1 o9 Z6 N# X7 U8 C3. Candidate with design or product experience is a plus
4. Fluent in English.
5. Work location in Hsinchu, Taiwan."

Package： around annual NT 300萬 ~700萬
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& s& X6 w  c3 h/ R6 uStock： providing stock option depends on experience

意者請與 chip123@chip123.com.tw  聯絡！