外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

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美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
7 F0 d6 B* p# N/ J請發送履曆或者您的問題到lowpowerdesign@hotmail.com，爲您一一解答
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Based in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
2 V! A" }1 s& O) |partners in fast growing ASIA operation team
Assembly and Bumping engineering and operational management include:
) v, s9 |1 c' @! R6 R! n! u3 s- New package and product characterization, qualification and implementation.
- Packaging process improvement, alternative material and cost reduction.
- Excursion and operation performance improvement.
: h6 F# O2 l& V' v0 U- Cross-organization functional coordination between package development, product
engineering, supply chain, quality and subcontractors
Requirements/Qualifications (Education)
- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
- 10+ year hands on experience in assembly and bumping operation
, D5 Q, [( n7 Z# E! i6 g' z- Oversea management experience on direct OSAT subcontractors and system level
customers
- Self motivated with strong work ethics
, ]8 J) L& k, j& c0 e6 i- Excellent negotiation skills
- Excellent communication skills in both Chinese and English
1 n4 R) p9 |) N, d  g% s- Project management, DOE, 6Sigma.