某半導體大廠徵求Technical Manager

chip123

Title Responsibilities：

. O" {5 P7 M! [7 c1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
5 P4 J. ~6 X5 c  ^: i2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
3. Planning, setting priority, and exeution of short and long term tasks.       
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, ~) m& K9 G5 S" r0 {Requirements：
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3 U0 ]+ r' S0 z/ B7 R2 F1. Minimum master degree in engineering field
) g( V: M3 W1 H5 P4 ~: c7 Q/ Z2. Minimum 5 years of experiences in process integration or device engineering.
' y! }4 O3 s4 G, i; e- b; b2 P0 z( l3. Candidate with design or product experience is a plus
6 }8 U/ \8 d% Z- f0 m, |4. Fluent in English.
5. Work location in Hsinchu, Taiwan."
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3 t6 {9 D" X/ l3 q! N. ]Package： around annual NT 300萬 ~700萬

$ R- b* K  q) G% jStock： providing stock option depends on experience
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0 z7 \6 M8 Y- l: W1 d意者請與 chip123@chip123.com.tw  聯絡！