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Layout Guidelines for Optimized ESD Protection Diodes1 K0 B# o& ]& u
2 @, Z2 x- c" p6 ?( }) kKaran Bhatia and Elyse Rosenbaum
# ^ v+ N, N6 l9 RDepartment of Electrical and Computer Engineering • University of Illinois at Urbana-Champaign
- w, w: p( G* c# |, B1 h- w1308 W. Main St., Urbana, IL 61801 • Tel. +1-217-244-0578 • Fax +1-217-244-1946 • Email: ksbhatia@uiuc.edu
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3 f P3 r2 l$ a, I9 EAbstract - In this work, various layout options for ESD diodes’ PN junction geometry and metal routing are
; F# [3 X) z0 cinvestigated. The current compression point (ICP) is introduced to define the maximum current handling
9 R* Z8 a( v" _) L6 ~! A/ Xcapability of ESD protection devices. The figures-of-merit ICP/C and RON*C are used to compare the9 B: S( e2 ?* U* N
performance of the structures investigated herein. |
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