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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead" b- i$ Y7 q1 v0 @& G

& v5 p& }6 p4 G% ?公      司:One world top EDA company
7 z) \% u. a" z, c5 |% X6 Q% L工作地点:上海
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Position Description:  . H+ w  `6 u, }3 S# n+ k
1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. 4 F- T" J9 a6 y/ w- k& u' d# l4 `1 D

- @5 m6 _0 K! F3 C- c2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers:
3 D! E$ G5 K2 H' i/ f+ j6 F(1) xx  Palladium HW Acceleration Platforms
  f3 p  Z* L5 Q! V6 ]. E- E(2) xx Acceleratable Verification IP portfolio
& K. l0 h- d" i(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis& W* X& M8 ]. q& z0 a( K+ U
(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  + p( D4 N+ l1 F2 [
1. Experience:  
, f& c/ \5 |4 b! l2 |- Minimum experience required: 10 years  5 {" ?" q/ H+ w* A" M
- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.0 {" r! \( F  U1 ~  b
- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.
4 Y% F( N& @' j3 l& K- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
5 m, [) H% P: U0 x' D. g- Strong verbal and written communication skills in English are required  # R* @" b  m; p# ?! y
- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must ' V" u& L, N& F- p6 e
- Hardware verification, including knowledge of HDL simulators and debugging simulations
8 x% o- V' }$ L- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.
. U, q) S- i1 g' {+ k: [' a% @1 o2 b- Knowledge of embedded systems and software development for SoCs is a plus # u6 c+ K) r7 h" {
2. Education:  - o! U# _5 y: M! o/ C
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  
& ~( O4 M/ C2 m' V5 b6 J' ~- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience).
1 q1 i* {, w* x6 q$ Q3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer$ s4 W5 p5 x5 ?8 H
公      司:A famous IC company4 X. v; A6 o2 ~9 E$ O
工作地点:南京4 b# m/ Y/ I. A! p

. m& ?1 C& c4 DKey Responsibilities  % X" ]7 b. S$ j7 \! K
Depending on experience, key responsibilities will involve some of the following:  
3 W8 {6 y. I* N* e- B# qIC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
2 p: g- H: `& z  `As a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
6 C3 g' q! h, y2 A8 ~% O( A% TLeading a team of physical design engineers and resolving the technical related issues.  
2 H# L2 A, J+ |* E: j/ tCrosstalk analysis, power analysis, and static timing analysis.  ( q8 u; T7 ]) k; e2 e
Write scripts in Tcl to improve productivity.  / n! X' Y" W9 h3 y+ o( F
3 W( ^0 D$ ~; }# Z% a: ~) n* N
职位要求: B8 J8 h8 s( ?0 g0 E# n. W7 C
Experience: 5+ years in physical implementation engineering    ) S+ M* ^( ~% @9 N
Essential skills  
+ g# N* `8 R+ w1 G5 c( s$ N( s2 `0 fMS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  : k5 z/ h% U4 v( L& m' A
Experience with Magma or Synopsys place-and-route tool set and physical design project implementation.  8 o6 s$ `& {6 ~
Good programming skill. Capable of writing Tcl or Perl.  6 m1 b; C" x/ y  z1 T
Familiar with synthesis, static timing analysis.  
- G& s% U: g4 Q; v0 m% t8 Z' e) PSelf-motivated team worker, good verbal and written communication skills in English.  
( |8 z/ N/ a$ ]6 r+ b4 Y" [Technical and team leadership proffered. Previous management experience highly desired.  
, W" W8 D# ~6 }Experience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
7 P2 Z% Q3 c' z 4 G0 U# l! @) I. l. U6 W6 T5 d
俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 0 P6 C9 Z  k( A" c
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TSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」 % h% R  b  O- x
  [$ F  a0 t6 D* E" V! {
Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。 ( o) {6 q  u" J2 Z7 \

- _3 q) p: u/ a( U+ \兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。 2 c% B% m5 N. N2 S

! l0 |' o/ p0 |. x% U# N為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。 + u) m" r$ ^, Z) @

( g- \. k# k: q7 J9 C! m& m因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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