外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

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美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
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+ w" W+ q& \0 ?6 q  R6 y* }5 xBased in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
partners in fast growing ASIA operation team
Assembly and Bumping engineering and operational management include:
- J, C9 C. L/ Z) q, y- New package and product characterization, qualification and implementation.
- Packaging process improvement, alternative material and cost reduction.
& Z% N9 M4 |  `% l! v: z- Excursion and operation performance improvement.
* J$ {3 r5 m# Y/ {& H- Cross-organization functional coordination between package development, product
engineering, supply chain, quality and subcontractors
Requirements/Qualifications (Education)
- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
- 10+ year hands on experience in assembly and bumping operation
- Oversea management experience on direct OSAT subcontractors and system level
0 j  z; j. b( j4 d3 q1 m- x) icustomers
! @4 Q! W, N  d3 a! c( o# T- Self motivated with strong work ethics
- Excellent negotiation skills
- r  C( B) w. L8 f0 u- Excellent communication skills in both Chinese and English
5 q& @/ E) C9 |6 e1 r- Project management, DOE, 6Sigma.