外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

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美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
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Based in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
partners in fast growing ASIA operation team
/ V8 |! D0 ]4 YAssembly and Bumping engineering and operational management include:
, @' n5 _* B. H4 A- New package and product characterization, qualification and implementation.
- Packaging process improvement, alternative material and cost reduction.
: r' r7 }! n- {; l4 l: C- Excursion and operation performance improvement.
6 e, h( X/ m! f/ R7 g  S) F- Cross-organization functional coordination between package development, product
engineering, supply chain, quality and subcontractors
. W* }# L& S! s/ ?1 G7 P2 d' f5 yRequirements/Qualifications (Education)
4 y( y1 l. c# ~& j- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
' ?7 p' m- N/ Q# {' O9 `5 y9 D9 O4 c- 10+ year hands on experience in assembly and bumping operation
5 a4 [3 \& z. \- Oversea management experience on direct OSAT subcontractors and system level
customers
- Self motivated with strong work ethics
- Excellent negotiation skills
4 r7 m8 S+ q; l6 M- Excellent communication skills in both Chinese and English
4 }  m& E! C+ y3 S- Project management, DOE, 6Sigma.