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Maskless Lithography – NRE-free Alternative for Deep-submicron ASICs 9 S$ V( A' g( c7 t% ?
eASIC’s innovative use of LUT-based logic programming combined with single via layer customizable routing makes its technology an ideal candidate for maskless lithography using Direct-Write eBeam customization. Because all of the interconnect customization is performed on a single via layer (Via 6), routing customization can be performed efficiently by eBeam, eliminating the need for costly lithography masks.( U& Z8 c3 {# B- ?! k$ N" V+ Y
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Using eBeam with eASIC technology: Customer Advantages 5 c* Q1 J2 x7 \) D/ N9 ~' U2 T3 ?
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Eliminate mask costs – NO NRE
2 b) ^' ]8 v5 Q! E) bAllow multiple projects on the same wafer
" r3 [* ^' k. x: R7 b o No minimum-volume required
1 z# f1 H8 x( t9 fEliminate days of mask creation time
& [1 H5 d7 x( u! h) i e, I& q$ E0 OCut time and cost – Via–only customization proceeds at 10x the speed
! l+ q, i. e4 F) Y" [( K1 ERely on proven maskless technology * T- j9 w2 U; h1 _
o Available from multiple vendors: ST, Toshiba, UMC, and more |
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