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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has) }2 O+ q. G! B' J
been widely used as an effective on-chip ESD protection device at
$ K/ ]1 B5 T, G% OGHz RF and high-speed I/O pads due to the small parasitic
# p- G* G6 z2 q( t0 Rloading effect and high ESD robustness in CMOS integrated
* y P/ C w& }% Y) L! g9 ]6 l7 }circuits (ICs). This work presents new ESD protection diodes
* W1 U+ w/ A' G% o9 Zrealized in the octagon, waffle-hollow, and octagon-hollow layout
0 p; B0 g- g5 x* [% _" Lstyles to improve the efficiency of ESD current distribution and
7 C" [: i/ {/ E4 O j6 C! uto reduce the parasitic capacitance. The new ESD protection
8 J7 r- A& C8 C' e$ X# sdiodes can achieve smaller parasitic capacitance under the same) \: E2 | P7 W; O8 B9 T) C
ESD robustness level as compared to the waffle diode. Therefore,
: k9 e- b+ U$ d. c$ lthe signal degradation of GHz RF and high-speed transmission4 E. A+ d% E5 y& J
can be reduced due to smaller parasitic capacitance from the new
' z$ B9 J- S9 S2 v+ r/ A/ V9 M5 M4 ?proposed diodes. |
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