ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
3 D! D( |! B3 Z' [; r9 T我的IOB超出範圍出現以下錯誤..該如何解決啊??

" W5 w7 [& K$ IERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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& Y" R+ Z7 @4 P8 K7 @! U: NERROR:Map:115 - The design is too large to fit the device.  Please check the
   Design Summary section to see which resource requirement for your design
8 P0 K% T' c1 {5 ?   exceeds the resources available in the device.  In particular check the
& j$ j9 J. W* v* `. h9 V   non-slice resources since the slice counts may reflect the early termination
9 k$ C! |; Z' _0 M   of the flow.

   NOTE:  An NCD file will still be generated to allow you to examine the mapped
   design.  This file is intended for evaluation use only, and will not process
. v# j9 N8 a% m# ]/ Q   successfully through PAR.

8 P7 l% ^& m, d3 e: lERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
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6 N3 t0 F5 K5 p謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!