ISE的問題...請教前輩們

mclaren_18

   如題:
各位大大們:
請教一下  Number of bonded IOBs:                563  out of    440   127% (*)
我的IOB超出範圍出現以下錯誤..該如何解決啊??

9 ]' S& ^1 I2 Y6 U% iERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.

ERROR:Map:115 - The design is too large to fit the device.  Please check the
; w: _/ k* w9 ]% T5 n   Design Summary section to see which resource requirement for your design
   exceeds the resources available in the device.  In particular check the
9 x: w  k. `% o) n   non-slice resources since the slice counts may reflect the early termination
* M0 g) j; d! b   of the flow.

" z. {0 \* e% ]! F   NOTE:  An NCD file will still be generated to allow you to examine the mapped
# \; Q% ~" {0 I# d   design.  This file is intended for evaluation use only, and will not process
5 J9 K0 x2 x+ a( F   successfully through PAR.
3 d6 k4 E+ c8 l3 Z6 N
ERRORack:2309 - Too many bonded comps of type "IOB" found to fit this device.
# }. ]# z) t9 W: A
9 u6 ?7 A( N' x- v, p! {謝謝      

ssejack1

Device 的 IO block 只有  440  但 design 須 563 !超出了!
換較大的 package or 減少 IO 使用數量!