Ansoft 2008 HF/SI/PI/EMI/IC/EM 技術講習會

chip123

日期 :  2007 年 10 月 4 日 時間 : 9:00am ~ 5:00pm
地點 : 台北國際會議中心  地址 : 台北市信義路五段 1 號

	Ansoft 2007 HF/SI/PI/EMI/IC/EM 技術講習會
Ansoft技術講習會報名按此
欲參閱詳細演講課程表者請按此
欲參閱主要課程內容介紹者請按此
參加Track 5電機機械課程者,欲參閱詳細課程表及內容介紹者請按此

chip123

chip123

DATES & LOCATIONS | CALL FOR PAPERS | ABSTRACTS

TAIPEI, TAIWAN Date: 10/22/2008 Venue: Taipei International Convention Center (TICC) Agenda: Pending Register: REGISTER NOW

chip123

日期 : 10月22日(星期三), 2008 時間 : 9:00am-5:00pm Cost : Free with Registration 地點 : 台北國際會議中心101室 台北市信義路5段1號1樓 101室 Time Topic 9:00-9:30 Registration 9:30-9:40 Opening-Room 101 9:40-10:10 Keynote-Inspiring Engineer-ANSYS Vision and Strategy 10:10-10:50 Coffee Break / Demonstration / Split into Session (40 min) Track 1 Track 2 Track 3 Track 4 Track 5 Hign Performance RF/EMI/PI/SI/Full System Channel EM : High Performance Electromechanical and Power System 101 AB Room 101 CD Room 102 Room 201 ABC Room 201 DEF Room 10:50-11:20 Phased Array Antenna System Design (A two-part tutorial) Part 1 Super Compact Miniaturization of Monolithic Passive Integrated Incorporating Multilayer Synthetic Quasi-TEM Transmission Lines -IEEE Fellow Prof. Ching-Kuang Tzuang /NTU Virtual Compliance Test Bench for PCIe, SATA and HDMI Statistical and Transient Channel Modeling for Crosstalk, Bit Error, Jitter and EMI Improving Product Performance through Advanced Simulation Techniques for Core Loss Calculation, Permanent Magnet Losses and Cogging Torque Optimization - Partner Company: Siemens AG 11:20-11:50 Phased Array Antenna System Design (A two-part tutorial) Part 2 40 Gb/s Pre-emphasis, CDR and Equalizer CMOS Circuir Design with Full Channel Simulation Low cost Embedded Common-mode Noise Suppression Filter for GHz Differential Signals - Prof. Tzong-Lin Wu/NTU Analysis of Digitial Display Frame Symbols and Their RFI Impact in Wireless Channels- Partner Company: Intel Three-Dimensional Simulations of Claw-Pole Generators for Wind Power Applications - Prof. Wang, P.J./NTHU 11:50-13:20 Lunch (1 hr 30 min) 13:20-13:50 Planar Printed Internal Mobile Device Antennas - IEEE Fellow Prof. Kin-Lu Wong/NSYSU Electromagnetics and Advanced Circuit Simulation Co-design Is Enabling RF and Microwave System Design Foundations for Coupled Signal Integrity, Power Integrity and Electromagnetic Interference (A two-part tutorial) - Part 1 Addressing Electromagnetic Interference and Compatibility on Mobile Platforms - Partner Company: SamSung VHDL-AMS Modeling of an Electric Power Steering System in a Multi-Physics Simulation Environment 13:50-14:20 Antenna Platform-Level Integration - Partner Company: HP Employing 65ns CMOS SOI for 60GHz WPAN Applications, Pt. 2 - Partner Company:CEA-LETI Foundations for Coupled Signal Integrity, Power Integrity and Electromagnetic Interference (A two-part tutorial) - Part 2 RF Signal Integrity Nissan Motors' S-Tool: A Multi-Physics and Rapid-Prototyping Simulation Environment - Partner Company: Nissan Motors 14:20-14:50 60GHz Phased Array: Design and Measurements - Partner Company: Ogino/Taiyo Yuden High Average Efficiency Linear Transmitter Using Envelope-tracking Class-E Power Amplifier for 3G and WiMax Applications- Prof. Tzyy-Sheng Horng/NSYSU System's plan for LVDS TX SI and EMI analysis- Mr. Milkman Hsuan/Himax Disk Drive EMI Design- Partner Company: Seagate Actuator Design: Meeting your Customers' Requirements for Success 14:50-15:20 Break (30 min) 15:20-15:50 Radome Design for Airborne Radar Using New Boundary Conditions in HFSS Ferrite-Coupled Circulator for Application at S-Band Frequency - Prof. B.C. Tseng/FCU DDR3 Memory Module Design - Partner Company: MetaRAM Simulating EMC/EMI Effects for High-Power Inverter Systemss- Partner Company: Pearl Lab, Alstom Mechanical Reliability - Fadi Ben Achour/ANSYS 15:50-16:20 Recent Advances in Numerical Simulation of Biomedical Application Signal Integrity Issues of Guard Trace in High-Speed Digital Circuits - Guang Hwa Shiue APEMC Lab, Assistant Prof./CYCU Altera Design Kit for a full Multi-Gigabit-Per-Second Channel - Partner Company: Altera Tracking System EMI Problems - Partner Company: Panasonic Simulation-Based Performance Characterization of and Electric Drive Train System 16:20-16:50 1. High speed and RF device test challenges and proposed solution - Mr. James Lu/Keystone 2. High Speed and RF connector with test fixture optimum design- Mr. Albert Horng/ACES Package/Board Thermal Mgt. - Fadi Ben Achour/ANSYS High-Speed Serial Design Flow for Pre- and Post-Layout Verification - Partner Company: Altera Numerical Modeling of ESD Source and Protection Devices for Mobile Platforms - Partner Company: Samsung New Simulation Capabilities are Changing Power Electronics Design - Partner Instituton: University of Madrid Happy Hour - Giveaway