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[經驗交流] ASIC設計工程師如何保住飯碗?

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41#
發表於 2014-6-12 10:46:55 | 只看該作者
Junior Physical Design Engineer
  y* J! P7 o& `  [
2 j+ n" B0 v. o9 q+ }) N/ z+ G7 T6 r: {公      司: famous IC company( d' d, Q( x" }/ q& T4 k5 k
工作地点:北京) o4 V" E; D/ E

- h0 \" s  k/ h, [& H+ f& wPosition Tasks, Duties and Responsibilities
( z/ Q: f. `; JThe ASIC Physical Design Engineer will:
; s, S6 y& z6 Z, b/ p* s* `        Complete third party IP integration and ensure vendor guidelines are followed. 4 G+ a% n! _8 Z+ t3 h3 q# {1 Y
        Responsible for physical verification (DRC/LVS).
' X, K' N; p+ w: g        IO ring design, fullchip floorplan.
6 d0 T" w( X, l3 ]4 ?        Block level implementation.
6 b# _# S9 {# `        Work with front-end engineers to resolve problems and achieve design closure. 5 _7 N* G" l* f  u9 c
- V6 e0 I$ x3 v: C+ T) Z
Candidate Qualifications: 4 Z5 {: K# U7 m+ [4 H/ o
Candidate must:
/ N- \; Y4 g8 H" B; p! W& \2 }! }        Hold BSEE (MS preferred). " o5 e, b6 C! D0 E' H+ v
        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification 2 {6 b  j6 C2 S$ [# P
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. & g7 P! v9 l; _
        Have the ability to independently identify and resolve design, tool, and flow problems.
' V; v7 K2 S: m; Z5 o        Have related timing and physical concept.
- ^7 l" X% L9 N5 }2 [        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
: t/ w/ S( p/ d8 `        Familiar with EDA tools. ) i$ b- u; @, g; y( z, x8 }
        Familiar with Linux environments.  ' F" T6 G" b! J0 ~6 s$ l7 s$ Z

9 Z, i  C" R* K; C' N# a# OAny of the following is beneficial: ( H% Q9 i4 k& [" T2 _1 u7 d
        STA constraint design 1 C& `4 b' ^4 \
       Equivalence checking ?RTL to gates, and gates to gates.
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42#
發表於 2014-6-19 09:41:01 | 只看該作者
Junior Physical Design Engineer4 O* Q: B- x* |) ]5 Y, m  t9 \

2 ^2 |( q7 W1 D$ U4 o4 X  u# ]公      司:A famous IC company; v/ W0 ^7 F) n* |/ D5 \/ \3 A" I; J
工作地点:北京
5 N' N* v9 B6 \' K, E, B3 ?8 O& m  U+ N2 b& I' q
Position Tasks, Duties and Responsibilities ! [! `% \8 v$ W7 {! Y; x1 |
The ASIC Physical Design Engineer will: $ q& _$ |. l% S& S" A
        Complete third party IP integration and ensure vendor guidelines are followed.
, Q4 V, K& B7 c8 y$ m% I        Responsible for physical verification (DRC/LVS).
+ H% O* S3 q& c        IO ring design, fullchip floorplan.
# r) R" V! b- Z0 y/ @        Block level implementation.
/ m7 Y5 ^% k2 D3 ]8 U3 [        Work with front-end engineers to resolve problems and achieve design closure.
  l* l1 X3 q8 R8 f! J4 D3 E* I* n$ I7 s! `
Candidate Qualifications:
! ^! C+ O' m: u; M4 B( {, i7 C0 TCandidate must: 5 j! j4 o8 L+ ~5 `2 C- Q& W7 t
        Hold BSEE (MS preferred).
8 c5 r% y& \9 }9 w8 z& s4 d% U        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification - l2 ^$ |/ F  ^7 ]6 ^3 n
        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC. ; P7 }3 A1 r3 `, S6 K' `' r" I
        Have the ability to independently identify and resolve design, tool, and flow problems.
1 h0 V" ]  c' R6 l' l        Have related timing and physical concept.
6 b- T! m* s5 ?* O        Be able to design and implement physical design strategies and methodologies for deep submicron designs.  g. _# C- r* z8 \( q/ w4 ^. K
        Familiar with EDA tools. & A/ f  M0 o- S/ ?( U, \
        Familiar with Linux environments.  2 q* h! D! H8 p! ~2 o
) u) y6 Z; l: @5 F( i1 r* f
Any of the following is beneficial: 1 ~+ u/ a4 @, q) Q5 N) R, q* f2 u, \' m
        STA constraint design ) l6 `- v) ^" p0 X
       Equivalence checking ?RTL to gates, and gates to gates.
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43#
發表於 2014-6-19 09:42:41 | 只看該作者
Sr. ASIC Design Engineer (encoder/decoder)
  g9 E* [5 f& C9 R2 G2 N# s
: [% S/ H& G: x* C- |. B公      司:a leading developer of advanced digital imaging solution
+ }6 c* X4 ~# u& D. L工作地点:上海6 G0 o* q' P7 P
9 E8 K9 T: `  R  y* D
Position Overview: The candidate will join a team of  highly competent ASIC designers involved in design, verification, and implementation (ASIC) of advanced platform for XX''s future generation multi-media products.   0 S7 b  B, s6 g  M  A  r
, {1 m+ N3 s; b
主要职责 (70%)
6 j1 M' @$ X! ^  R. L+ mIn-depth knowledge of TV encoder and decoder design. Good understanding of TV system design.  
" E" D& `7 }# f4 s: SProficiency on digital filter algorithms and hardware implementation.
) O8 F$ p+ [% a. `4 i# }/ L+ wDevelopment and verification of complex IP module, integration of the IP module into the Soc devices, top-level design handling, system level testing. * A) @( M! Q# y7 ]& o
Participate in the FPGA platform development and lab debugging   % x2 |$ `1 t( p1 I: C

% D6 k6 [' |+ x! t8 ^其他职责 (30%)
8 @  R( }1 ]; `$ {7 Q3 YParticipate in block level architecture design Assisting embedded FW development.
( f6 m8 O& U) E# v( A2 I: H职位要求* F  c/ V% [0 `2 K' F- \
岗位资格
* Q. b0 l3 d  j, J0 @经验/技能 7 s9 F! ]1 g1 Q7 o* P: ?
1. Strong knowledge of TV technologies, knowledge of image signal process and CCTV system is a plus ; B, A+ _/ E/ v4 t
2. Strong knowledge of ASIC design flow. Can define Micro-architecture of the IP module and /or sub-blocks. And able to write detailed engineering specifications. : T* H! l2 `9 e2 u: {& O' X
3. Good communication skills, especially in technical writing and reporting; , _" P! g1 o. \# I4 F
4. Self-motivated and ability to excel in a team environment.   
) U' k9 ?+ O; a" ]9 B$ O( D  `" I( V; h- J5 \* `; B) U  F
教育
7 c( T8 t4 X) h8 F7 j8 {MSEE/CE with 3+ years of industry experience
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44#
發表於 2014-6-20 09:03:13 | 只看該作者
Senior Digital Design Engineer2 ?5 y7 O3 W- Z1 V5 ^8 X

  T# v. W+ W) i- L0 W公      司:A leading semiconductor company& w; H9 \& t& g& u
工作地点:香港
4 P6 E7 V7 W5 V  F& T: a# S5 ?3 |2 C) l& W
Job Responsibilities: $ h* O$ R& |1 n# t, B) {
    Perform logic design, RTL coding, design verification, logic synthesis, DFT and static timing analysis
: n4 L) [. Z8 `" D# a9 F: K. P    Develop verification environment and coverage closure
. S8 Y$ k, C6 b6 L    Support wafer level testing and silicon evaluation * A6 D3 r2 O1 M3 s6 D+ W
    Prepare technical documents
+ ]6 I( L, [* ~6 j' a+ j& o
/ ^6 X: J8 k, l6 s. JJob Requirements:
% C. @9 D; p+ _* j    B.Sc or above in Electronic Engineering or equivalent. Applicants with postgraduate degree would be considered as an advantage! ~7 H/ K' P+ Q  ~# L- f
    5 Years or above of solid experience in one or more of the following areas: Verilog-based logic design and synthesis, constrained random    testbench with System Verilog & UVM, assertion based design verification or circuit-level SPICE simulations
/ _( n/ d7 s1 @- g3 Q& @    Knowledge of SoC and embedded system. & A1 p/ m) W$ |% l6 |  n; W
    Knowledge of scripting languages such as Perl, TCL and Make
7 D$ b+ T3 l" I; k# W2 ]5 F    Candidate with less experience will be considered as Digital Design Engineer
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45#
發表於 2014-6-24 11:57:06 | 只看該作者
Junior Physical Design Engineer
3 |& E$ t! z7 t2 [6 w公      司:A famous IC company
2 r. P2 ?! C& F6 w1 r工作地点:北京7 G; T5 B3 S& r* A  _2 p
% M4 J8 {/ E: m! X9 U1 V1 }4 |
Position Tasks, Duties and Responsibilities " h) L/ @4 i) a* J. y9 l
The ASIC Physical Design Engineer will:
( a+ R" l; E2 F" ^9 Q        Complete third party IP integration and ensure vendor guidelines are followed.
6 ~1 L) r& `8 b/ n        Responsible for physical verification (DRC/LVS).
+ `. Z' o: B0 Q        IO ring design, fullchip floorplan.
" u5 a1 C: }5 H5 p; @        Block level implementation. ' T8 U3 a+ [3 D/ \$ E. Z- I& g1 H
        Work with front-end engineers to resolve problems and achieve design closure.
# H+ a- P5 S# R( M
0 m$ \: Q  m6 j4 [Candidate Qualifications:
9 P6 S% b/ @/ B3 Q" p6 \Candidate must:
5 s4 O+ B$ D. E4 ~, Y5 V4 d        Hold BSEE (MS preferred).
9 M6 g6 g* _  I9 |        Have minimum of 3 years hands-on experience in full flow IC back-end physical design and verification
6 i/ L3 B: U  [& Z        Be able to complete block and chip level tapeout quality LVS and  LVS and DRC.
2 E; p% ^6 F/ K        Have the ability to independently identify and resolve design, tool, and flow problems.
" m* B7 m" A/ K        Have related timing and physical concept.
7 J$ A6 G3 S9 J. ^2 o        Be able to design and implement physical design strategies and methodologies for deep submicron designs.
8 A0 f! h' g  O( L. A" t0 j* R        Familiar with EDA tools.
0 E: I7 k& R0 d, q        Familiar with Linux environments.  
* h2 J* J& n8 `$ o/ X) u3 }* B1 a) u1 s4 N' c0 c7 j
Any of the following is beneficial: 0 v8 D& H: o! c7 j5 i* l+ X3 `
        STA constraint design
% n$ F. P: l$ |# c4 x* ~       Equivalence checking ?RTL to gates, and gates to gates.
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46#
發表於 2014-7-31 12:31:20 | 只看該作者
数字芯片设计工程师(DFT/综合)
+ |+ X9 c7 L, P+ ^/ \
6 S& w2 S& t9 L1 r$ Q公      司:A mobile chipset semiconductor company
" u& o6 M/ q$ f  c4 b工作地点:上海
1 P1 y, J7 f- O$ y
$ X+ a2 x/ F: R. q( u/ }  U2 [( D职位描述:
+ D7 j7 d0 M3 H4 y, G  A$ c1 e1、To provide and support SYN&DFT work for several projects in parallel  
/ z! C. x. B/ g+ O. |2、Run block level implementation for each project, include synthesis, DFT and LEC   U* L# U, h% B8 I7 i
3、Support block level physical evaluation  ) |, {, g" l7 Q' {
4、co-work with designer and provide block level SDC file
! [0 b5 c$ Y, T  z5、co-work with Back-end team for timing signoff6 U- P7 D8 j. J" P/ v0 e
0 y) [1 d/ r* X9 ]4 ^% e# T
职位需求:
3 F1 Z. H) d* m1. 了解集成电路设计的基本流程
# F7 P" g* ]; A) Y3 V2. 相关Synthesis, formal check 和DFT的工作经验。(3A, 3B, 3C精通一项即可)
5 ^2 ^  Q7 s* e. S$ M' F3A. 有超过2~3个项目的synthesis 经验, 用过RTL compiler且熟悉timing的相关知识  8 ?4 p% e% `5 ^4 {/ }- L
3B. 有超过2~3个项目的formal check经验,熟悉CPF的low power flow
" r! ^+ |5 Z0 s3C. 有超过2~3个项目的DFT insertion经验, 用过Mentor DFT的优先考虑
  G) c* f3 U% C" ?" `2 T7 j3. 具有良好的英语阅读和书写能力。
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47#
發表於 2014-10-29 08:13:11 | 只看該作者

ASIC Corporation將展示節能、高頻寬效率的C-RAN解決方案

西班牙巴賽隆納--(美國商業資訊)--eASIC Corporation:( b) D* `) V2 f5 N' Z/ m  U

. g! z3 d+ g* {0 E% @$ a人物:
* M9 r% B  A) W# o7 C# y
; h$ X( H5 t- W領先的單光罩自適應ASIC設備供應商eASIC Corporation將由eASIC無線業務主管Christian Lanzani博士擔任代表,負責整體無線策略,包括無線存取、去程傳輸(fronthaul)連線、基頻處理和回程傳輸解決方案。 . z4 q3 s6 C2 ]- t7 w

% \$ y. Z  K3 ~9 l" U  y事件:' T+ s. A3 k3 l! |( ^' L. N6 u% S
! ~# ^6 k7 N9 ~6 L9 ]
eASIC將作為聯合贊助商參加Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會(Wi-Fi World Summit & Fronthaul & C-RAN Summit),展示C-RAN去程傳輸在部署方面的挑戰,提供eASIC解決方案的細節。展示過程將包括無線存取、CPRI over OTN轉換器和基頻集區,包括L1硬體加速的使用案例。1 J0 q' J* l  O. x8 y

! V7 c$ s' q3 q時間:2014年10月29日,週三
/ f6 S: T) S; D4 _, m5 b地點:西班牙巴賽隆納赫斯珀裡亞塔樓酒店(Hesperia Tower Hotel)
( a* r$ @. d# x, D* D2 e" W7 D7 G3 {* L' u  d
如需瞭解有關eASIC Corporation的更多資訊,請造訪www.easic.com。Wi-Fi世界高峰會、去程傳輸暨C-RAN高峰會細節可以從以下網址獲得:http://wifiworldsummit.com/
  c$ h9 c) F* X8 c- o( \7 P& o" z$ A! E
關於eASIC/ f# I) J- Z: Y$ ^" b" ^" l1 Z6 P

; F' _6 g. l" neASIC是一家無晶圓廠半導體公司,提供突破性的單光罩自適應ASIC設備,旨在顯著降低客製化半導體設備的整體成本和縮短投產時間。使用通孔層客製路由的專利技術實現了低成本、高性能和快速周轉ASIC及單晶片系統設計。這種創新構造使eASIC能夠提供前期成本顯著低於傳統ASIC的新一代ASIC。eASIC Corporation是一家私人公司,總部位於加州聖塔克拉拉。投資人包括Khosla Ventures、Kleiner Perkins Caufield and Byers (KPCB)、Crescendo Ventures、希捷(Seagate Technology, NASDAQ:STX)和Evergreen Partners。如需eASIC的更多資訊,請造訪www.easic.com
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48#
發表於 2015-2-23 20:44:05 | 只看該作者
Asic 的利基市場和 Fpga的利基市場 各有千秋." e1 g- ~; X8 ~; l+ f
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49#
發表於 2015-7-23 21:32:34 | 只看該作者
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