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危機就是轉機?類比IC廠逆勢擴大徵求IC設計人才?你覺得去哪家最好?

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1#
發表於 2013-10-14 15:58:29 | 顯示全部樓層
Product Engineer -QA
7 r- C  q: |! Y3 F* ~公      司:A famous IC company
4 x. T  P$ k* D: n8 s8 C9 I工作地点:上海4 ~1 _. h+ t& r; f$ z7 y9 x4 ?

9 f' {% ?' s, bPosition Summary: ( ]* s# w% d2 I/ \
Essential Job Functions/Accountabilities:
6 F) K% ^" d2 A3 z5 l9 E: bWork closely with RD and PE team to  
  Q+ }6 s6 r) ]Make sure product (software) quality 1 T! s2 f9 g$ l1 E. y: T
QA system maintain and improvement
7 O$ [' M$ f5 z7 nDaily build and daily regression test
0 G: F* ^6 b. h" uProject management and risk control * ]( @  A+ e4 [, c% s
Bug/enhancements verification and testing
7 R4 Z5 Z* x/ u, `1 w% [) P, p# R6 BProduct release and documentation 1 \& R2 P2 S+ i% \# b; N2 D5 y

5 M2 L# a7 B: S; b" p6 }Minimum Requirements/Qualifications: 1 H" d3 ~1 p" z2 t% _
Strong scripting skill, Perl/TCL and LINUX shell required
9 q& q& n! J9 t5 x: |( h  F/ U+ {, \Experience of SPICE-based(HSPICE/Spectre/Eldo) circuit simulation
: i4 X& @6 l9 W$ p6 k6 [0 GExperience of package and PCB modeling and simulation with field solvers ! H& P3 G* I( I2 }! A6 o2 j
Knowledge of High-Speed I/O (DDR) power and signal integrity analysis 2 ~2 _- R7 |# Z) w; C6 B" a3 K& s
Knowledge on die and IO ring physical design, LEF/DEF/GDS is a plus . g2 H1 P9 k, H5 h1 e
B.S. in Electrical Engineering or other related areas, 3 years of experience % F$ g: p5 W4 `: n' F+ Z, K" s' c
M.S. or Ph.D. in Electrical Engineering or other related areas, 1 years of  experience, or equivalent combination of education and experience
0 ?4 ]# A- k+ s  h  f0 _Self motivation, teamwork and strong English communication skills ( both written and oral )
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2#
發表於 2013-10-14 15:59:08 | 顯示全部樓層
Sr. Software Engineer-电路仿真和建模; H; G9 z+ E- q# \2 ?# r: ^: C
- L, b" D$ t. |# ?$ Y  V7 b$ i
公      司:A famous IC company; K" E; y' w% ]5 G0 o
工作地点:上海
( T1 T. R% u* n% v( s" t) `' R$ F* @1 |5 D( v8 k' _
Position Summary:  1 l6 ~$ x+ C/ N$ b) G9 H( \0 o. K, R
Software development and product engineering for power and signal integrity analysis and modeling 0 l% U0 D+ |, C
Essential Job Functions/Accountabilities:
4 B5 m; h: G) S" UMaintain the IC-package power and signal integrity modeling software, conduct bug fixing and enhancements; develop new features to expand the application and improve the accuracy, capacity and speed; perform development level testings and work with application engineering team to resolve customer issues;* G, e6 W" c; W2 f

3 i7 f0 I' G% a$ r) SMinimum Requirements/Qualifications:
; M; x2 c5 t2 p- y/ [Strong experience in software development using C/C++ . D: _/ g$ B5 L, j1 Z( O7 B+ ^2 a! R
Strong working knowledge in linear and non-linear electric circuit network analysis and modeling
. L& `- @# W2 MKnowledge ofSPICE simulation, or on-die and package extraction is a plus
4 b, q5 }% s1 W) Q* x+ VExcellent communication (both written and verbal) skills in English
' L5 I: r& a5 ?! gMS, Ph.D. in Electrical Engineering, Computer Science, Physics/Math or related fields
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3#
發表於 2014-3-6 14:39:01 | 顯示全部樓層
Product Engineer
, M9 H0 t  U$ G) m+ @; n! {9 S公      司:A famous IC company
0 h1 ]' s' P* n: F2 T% l& u" U工作地点:上海
" ~1 [( G$ N* E: ~8 o! x
! f  y1 ^  S; M6 b$ b9 |# i职位描述0 t) Q# C# h! X" |8 e  }& \
Ideal candidate will have completed BSEE , with 5 to 10 years experience in
) R& q2 e/ b: ^$ Z2 S$ cSemiconductor field.
* A2 `- W; e6 i1 S$ L$ R9 Y* j: z# f8 S  S$ c5 }
Candidate should have strong oral and written communication skills -must be english speaking.
) L% {* E& n$ ]' t$ k( x( z( G1 V( j4 i$ `7 X
Candidate must have demonstrated strength with analog circuits, and familiarity with typical lab equipment such as scopes, DVM’s, curve tracers, and function generators. Strong bench skills are mandatory.
1 ?. ?) x% k* p5 ]* L2 ]- S+ ]% A" R
Ideal candidate will also have ability to debug IC’s to component level from design schematics and plots. 4 W! r8 k9 g2 t9 J: W, H2 A0 _
1 z  v. }, E. R$ e
Failure analysis background is a plus. $ x; `" ^9 x) n& A! j" k/ ^- b

( B7 T2 ^! G4 ]% g Candidate must also have ability to follow documented procedures, and must be able to work independently. Individual will report to management team in US.
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Job function to cover all aspects of New Product Development and Yield management,including bench-to-tester correlation, tri-temp characterization using ATE equipment, trouble shooting and yield management
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4#
發表於 2014-4-28 11:01:12 | 顯示全部樓層
高速模拟集成电路设计工程师
: r7 n" K4 h' m% b& _0 j公      司:A semiconductor company
, k4 Y( z% A) X' e8 W  B工作地点:上海
% ]" k. r% m4 R( O
. ^' q0 V* u, k8 o职位描述:  3 f3 Y2 f. h  m- m  t
1、负责高速模拟电路的设计、开发、优化;  
* i8 C4 W/ a2 M" y6 i- U$ ~4 u+ d. e2、版图的设计及验证;  
1 j+ `! i& q: B5 W9 O3、电路版图参数的提取及后仿真;  . I" {. _% t0 k2 w/ C' B0 e8 M
4、芯片的测试和分析。3 u( x' M$ I% V
. B) c% f/ b  K/ i8 _2 ^1 \
职位要求:
; O% n  _! A" U1 g% H* c5 X1)微电子、集成电路相关专业硕士或博士学位,或学士学位3年以上模拟IC设计经验;  2 p1 ]5 i3 K* M( N+ `) M) Z* X
2)熟悉和掌握模拟集成电路及版图设计的原理与技巧;  
0 d7 ?1 `3 V' N5 }4 e# x; C% @3)有通信系统用集成电路芯片设计和成功投片经验;  . G' Z; ~+ h* C2 x7 k. F1 v6 x6 \4 f
4)善于沟通、工作踏实、责任心强,具有良好的团队协作精神;  
3 L# H$ E& Q. T" j* S( W5 S5)有下述项目经验者优先:高速锁相环(PLL),时钟数据恢复电路(CDR),调制驱动电路,宽带放大器,限幅放大器,跨阻放大器等;
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