Test of TSV-Based 3D-IC

soctest2008

感兴趣这篇文章! 谢谢1

The Semiconductor manufacturing industry is today facing more than ever the challenge to explore the so-called “More-than-Moore” 3-D integration route in order to pursue the continued aggressive scaling of the historical Moore’s Law. The whole Semiconductor industry supply chain is being concerned: from IDMs to Fabless and CMOS foundries, from OSATs to Substrate and Circuit Assembly players as well. We believe 3D integration with TSVs could accelerate even more current consolidation happening in CMOS wafer fabs and the shift toward a fabless foundry model. As the whole industry supply chain is being concerned, all players are at the moment positioning on the technology and evaluating about which 3-D technology platforms need to be invested and developed for their own business

soctest2008

希望了解TSV 测试内容，需要Handbook of 3D Integration: Technology and Applications of 3D IC

soctest2008

也非常希望与大家交流TSV相关内容

soctest2008

TSV主要问题：1. 商业化的EDA 软件和设计方法；2. 由于功率密度增加而引发的热力学问题；3. 测试相关的问题

soctest2008

是什么延误了3D TSV的发展？

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Toshiba、Oki ElectrIC 用于数码照相机的图像传感器是第一种应用TSV技术的产品。

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第一块采用TSV技术的商用DRAM将于2010年投放服务器市场。

soctest2008

可编程门阵列(FPGA)将在2013年采用TSV技术。