Chip123 科技應用創新平台

 找回密碼
 申請會員

QQ登錄

只需一步,快速開始

Login

用FB帳號登入

搜索
1 2 3 4
查看: 6652|回復: 2
打印 上一主題 下一主題

[好康相報] 8/27(一) 台大 Design Consideration for ESD and Latch-up

[複製鏈接]
跳轉到指定樓層
1#
發表於 2012-8-17 15:11:06 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
時間:101年8月27日(一)下午2:00-3:00
5 `# v" d1 \- \# |, C- ~( @地點:國立台灣大學電機二館124會議室8 X% O% N1 P6 ^
演講資訊如下:
: e$ n' W$ Z8 P" g5 n
6 Z. Y1 `9 V! l講題esign Consideration for ESD and Latch-up
; q( y$ g7 P4 P$ D4 M' H  f: p8 W# s. C
大綱:. G# o- R3 K& Z3 H
Design Consideration for ESD and Latch-up ESD and latch-up are two of the most frequent reliability issues for commercial IC's. They contribute more than 25% of total IC failure during manufacturing and in the field. While often overlooked in the design process, as other factors such as performance and cost always attract most of the attention, design for reliability eliminates major hurdle in product introduction. The presentation describes typical reliability requirement, testing, and qualification for commercial IC's and the ever-increasing challenge posed by advanced CMOS technology. Various approaches that are commonly adopted by industry to ensure ESD robustness and latch-up immunity will be discussed. The emphasis will be mainly for custom analog and RF IC application.
" m: q- T0 j3 K& ~/ P- ?" o & a$ l; L4 t( J2 P( O- j
講者簡歷:  i- I2 O7 f7 P( d
Tzung-Yin Lee joined Skyworks in March 2003, where he is presently the senior manager in charge of Foundry Technology Modeling, ESD, and Device Characterization group. From 2001 to 2003 he was with Maxim Integrated Products working on WLAN product development. From 1997 to 2001, he was with Conexant Systems, formerly Rockwell Semiconductor Systems, working on the development of the RF front-end device for Bluetooth and coreless application. He received the B.S. degree from National Chiao Tung University, Hsin-Chu, Taiwan, in 1991, and the M.E. and Ph.D degrees from University of Florida, Gainesville, Florida, in 1992 and 1997, respectively. He has authored and coauthored more than two dozens of research papers in high-speed and high-frequency device modeling for RFIC design application.
3 R5 O+ D, n& x
6 {% O/ W9 a- ~" H5 x$ t( s- `主辦單位: 教育部醫療電子聯盟
# E$ O1 z/ G8 c* m4 m協辦單位:  IEEE SSCS Taipei Chapter 國立台灣大學-聯發科技無線研究實驗室  國立台灣大學電機工程學系 / 國立台灣大學電子工程學研究所
分享到:  QQ好友和群QQ好友和群 QQ空間QQ空間 騰訊微博騰訊微博 騰訊朋友騰訊朋友
收藏收藏 分享分享 頂 踩 分享分享
2#
發表於 2012-8-21 21:38:47 | 只看該作者
可惜了,台湾的大学只在台湾分享
3#
發表於 2015-5-11 16:00:35 | 只看該作者
可惜了,台湾的大学只在台湾分享
您需要登錄後才可以回帖 登錄 | 申請會員

本版積分規則

首頁|手機版|Chip123 科技應用創新平台 |新契機國際商機整合股份有限公司

GMT+8, 2024-4-20 12:28 AM , Processed in 0.101006 second(s), 16 queries .

Powered by Discuz! X3.2

© 2001-2013 Comsenz Inc.

快速回復 返回頂部 返回列表