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EDN named the winners of the 21st annual EDN Innovation Awards on May 2, 2011, at an awards ceremony in San Jose, CA.
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Brad Doerr, Steve Draving, Dave Dascher, Nick Fernandez, Ryan Carlino, Steve Tursich, and Dave Gissel, Infiniium design team, Agilent Technologies5 K+ Q, p; Y0 `- q8 _' O: k+ p. \
. M4 B+ g/ B( C% S' ~; XMario Paniccia, Intel Corp9 v# I1 p0 M9 d |7 x' ^. z
# v1 h; k7 }" { I6 pPaul Darbee, DarbeeVision Inc0 M3 x2 ^5 K3 l; ^1 x# @/ i9 R
* F+ k: s( [% g3 \: S. D4 }/ CRobert Dobkin and Tom Hack, Linear Technology
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ACP F-7024 and ACP F-7025 bandpass filters, Avago Technologies% h+ e2 Q; ~) m& p X0 [1 k
' T3 d+ g$ O# z6 `EM773 energy-metering IC, NXP Semiconductors
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! }2 Q( M8 h( M; ], wISL59605 video equalizer, Intersil* N0 B. }! i- M+ ?
& h4 N5 l/ L, A: d3 ~TimerBlox, Linear Technology
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FastRTV channel change acceleration technology, Broadcom Corp
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LPTM10-1247 and LPTM10-12107 platform managers, Lattice Semiconductor- i8 t; _- A: }: @8 s& Q
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Transcede 4000 baseband processor, Mindspeed Technologies
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VDAP1000, Integrated Device Technology
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6 Q6 T" ^: J% xXway Wave300 family, Lantiq North America
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BeMicro embedded softwaredevelopment kit, Arrow Electronics
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! ?, L ~2 | {5 w# y, DRapid Deployment Program for Android, MontaVista Software( [& L+ U7 l) K6 g
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Tower System, Freescale Semiconductor d+ e' y8 O/ |$ a9 H
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Virtex-6 FPGA DSP-development kit, Xilinx' e2 ~8 G0 R$ r) \
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Flash controllers based on MSP (Memory Signal Processing) technology, Anobit
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7 c2 u' b( E$ a9 V1 S( J! O n* L# RMobile XDR, Rambus Inc$ n$ I3 [: b" ` f; \0 t6 j8 n3 ]
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SmartFusion intelligent mixedsignal FPGAs, Microsemi Corp, X4 V: G. b y: `4 V; v$ m* l
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TXP1000 transcoders, Octasic Inc+ [% X; B( j# Y' y/ A
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" m) w. i% q2 FCalibre InRoute, Mentor Graphics
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" ]0 J8 Z* \" n( {( R5 y0 aDRC+, GlobalFoundries
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PathFinder, Apache Design Solutions; q/ B2 o( a4 i/ \+ G
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SoftPatch for RocketVision, GateRocket Inc. L: ?: T' R- a" o; ~$ [4 S
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8 r9 U* m: v! b8 t0 N& X360-Degree Wrap-Around Technology, Fujitsu Semiconductor8 O3 _7 q, X2 v6 c/ P h
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Crystal Touch multitouch projected capacitive touch panels, Ocular LCD Inc. O% y; @' I J8 A) ?: N
mTouch Metal-Over-Capacitive touch-sensing technology, Microchip Technology Inc: I5 `! u# h1 A
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mXT1386 and mXT616, Atmel CorpAMT303 rotary position encoder for brushless motors, CUI Inc& l+ V' R! z6 n1 _/ S
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AS54xx 3D Hall magneticencoder IC, austriamicrosystems
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MPU-3000 microprocessor family of motion processors, InvenSense Inc
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2 z. t9 E9 Z8 L3 u& LMT9H004 image sensor with DR-Pix technology, Aptina
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* k9 t, H: _% {. T5 ?. w" x5 G# oCAPZero, Power Integrations
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EPC1010 GaN FET, Efficient Power Conversion Corp
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" B! j; `1 L' X8 H* C" ^, S* |LT 4180 virtual remote sense controller, Linear Technology
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& q( U' G" W+ g) MP2110 Powerharvester receiver, Powercast' }$ B6 _- [ Y( h0 }9 Y& [
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1 M8 X& p$ i- y% y# i0 i6 y" l @BMR454 dc/dc converter family, Ericsson Power Modules5 ?+ u- {0 r. L/ S
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BSV-nano POL converter, Bellnix America Inc3 j# p& _/ @/ p
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N6781A two-quadrant source/measure unit for battery-drain analysis, Agilent Technologies& M# }- ~ \ q0 r
+ k, ^+ Y& @+ [$ P! G- r$ [- {8 eNovum digital modules, CUI Inc
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4 k8 Q, _0 P9 m; }7 t2010 Intel Core processor family, Intel Corp% I0 r/ Y# Y# E) a' |( k) w
2 X5 ^- q$ `0 D/ w( R3 t, IARM Cortex-M4 processor, ARM
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Kinetis 32-bit microcontrollers, Freescale Semiconductor* {0 ~& } }9 m: T0 U; V4 i# f5 {
! y/ m# B% V4 j; E4 x2 dTMS320C6A8168 Integra DSP+ARM processor, Texas Instruments" U1 w, X& r5 f3 m" \8 X
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Power Debugging Technology, IAR Systems
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Sentinel Network, Ridgetop Group Inc" u: W0 i% C7 X r, y
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StegAlyzerRTS (Steganography Analyzer Real-Time Scanner), Backbone Security
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Webench FPGA Power Architect, National Semiconductor7 M& x( V& W: o1 U7 f, A
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PXI and AXIe test portfolio, Agilent Technologies
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3 T1 ? _4 P* G2 QPXIe-5630 vector network analyzer, National Instruments
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4 N2 |0 z" H2 d* [SPARQ signal-integrity network analyzer, LeCroy Corp
2 u3 ^ d5 P; lTLA7SAxx Series logic protocol analyzer, Tektronix |
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