SiP未來的出路

newstudent

SiP未來的出路如何？
  ]9 t8 E. [6 B+ E) p" Q沒有前段IC設計的經驗,只有後段封裝經驗,和RF component設計經驗,
沒有整個系統的概念,如何切入做SiP?

ychchip

SiP is useful to high density package, especially for a system integration.
7 S* {; z, e1 G7 J3 \8 i: Dmaybe it becomes more important technology recently. however, the potential in future sound compatiable with 3-D IC. Recently, It becomes a focus point in eduation of Taiwan. More universioties had the relative class.