請問在畫IC佈局時~有哪些問題需要考慮的~

vadj

請問在畫IC佈局時~有哪些問題需要考慮的~
# ^. v" @( d! C; b! {$ n, Y4 n例如天線效應、對稱性、latchu
請問還有些什麼呢？
8 j6 y: a9 P# Y, e. P( cPS 先不管是畫什麼電路，就請先說一些基本一定會考量到的問題。謝謝

小朱仔

很重要的一點
+ ~* S) K9 w. u( n耐電流
# `7 p0 M( ]) m8 U  Z$ U% w+ J每條走線的耐電流
5 K, \$ B$ b7 L$ O) YI/O Pad的電流
7 P3 l$ J1 q2 o; f4 s' B$ {IR Drop
Matching
0 a7 k2 Y0 Q1 R3 C# O9 _% o
% c1 n6 H8 `" Q( D$ }$ |3 |% S/ Ietc....

billionwong

1. Chip size. You need to know what kinds of package will be used.
2. Pad location. You need to confirm with supplier about the bond wire bonding.
, b6 }: a- h3 T  L% ]  ]$ y, Q# {9 G3. ESD and latchup consideration.
4 f4 S7 i$ }  r) u) Q% J! d- M4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path.
5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit.
1 p# r) q, @9 o+ @2 v. \( Y6. Make sure there is no softcon connection.
/ f) W+ T% b0 i/ h1 T: C3 p3 C7. How many metal layers could be used ?
! E1 t0 Y" x& V+ N5 k8. Metal Density consideration.

bjic

问客户，做客户想要的。也就是前端工程师
当然有时候还要凭自己的经验判断。

yoyo20701

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