表一、2011年至2016年全球半導體設製造設備支出預測(單位:百萬美元) w; p4 L- J" O9 M) V. @
| 2011 | 2012 | 2013 | 2014 | 2015 | 2016 | 成長率 | 1.6% | 4.0% | 9.4% | 4.5% | 6.7% | 7.2% | 半導體資本設備支出 | 65,754.4 | 60,937.4 | 63,042.4 | 66,863.6 | 62,540.2 | 67,894.4 | 成長率 | 16.3% | -7.3% | 3.5% | 6.1% | -6.5% | 8.6% | 資本設備支出 | 44,041.6 | 38,926.6 | 43,030.4 | 46,293.1 | 42,862.6 | 46,474.4 | 成長率 | 8.4% | -11.6% | 10.5% | 7.6% | -7.4% | 8.4% | 晶圓廠設備 | 35,822.4 | 31,289.5 | 33,487.0 | 37,100.0 | 34,090.8 | 36,542.5 | 成長率 | 13.3% | -12.7% | 7.0% | 10.8% | -8.1% | 7.2% | 晶圓階段封裝測試設備 | 1,472.7 | 1,404.9 | 1,893.7 | 4,305.4 | 2,214.0 | 2,646.9 | 成長率 | 17.2% | -4.6% | 34.8% | -9.7% | 8.8% | 19.6% | 晶粒階段封裝測試設備 | 4,311.9 | 3,997.3 | 4,766.1 | 2,853.6 | 3,859.5 | 4,004.4 | 成長率 | -12.0% | -7.3% | 19.2% | -1.0% | -10.4% | 3.8% | 自動測試設備 | 2,434.5 | 2,234.8 | 2,883.6 | 2,853.6 | 2,698.3 | 3,280.6 | 成長率 | -14.9% | -8.2% | 29.0% | -1.0% | -5.4% | 21.6% | 其它支出 | 21,712.8 | 22,010.8 | 20,012.0 | 20,570.5 | 19,677.6 | 21,420.0 | 成長率 | 36.7% | 1.4% | -9.1% | 2.8% | -4.3% | 8.9% |
資料來源:Gartner(2012年3月) |