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What Custom IC Design Challenges are you facing now?

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發表於 2007-11-12 17:38:00 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Please select the following issues that you believe EDA Tool Vendors should invest in based on your experience and design needs. :o
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  K# L& r2 }9 O, {4 Z; d! YAdd your comments to further explain how these issues are impacting your design process. And let's discuss these before 2008.
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, z& Z( `) X  J5 c3 @, l3 G1 d1.Time and schedule
8 s: T# K5 r, g' X" x! s2.Parallel designs e.g. layout and design engineering working at the same time
" s# G! d% E! G5 u; b3.DRC/LVS/ANT verification
& l, t: u) a- T: [* D4.DFT% U6 g' a. A& f, ~" _. d. f& h/ `
5.Working in a multi user environment
( c* D, L$ ~5 U& e  a* _6.Incorporating latest process node specifics (e.g. .65, .45 CMOS) ! p* O+ h! @2 V
7.More than Moore technologies, such as high voltage design, high frequency design, high current design, high temperature design, multiple   

2 m9 }% g" o& d9 o   technology support in a single design, Mems
9 {& g5 n5 n; r8.Incorporating RF blocks into standard designs (RF SoC Design)
  f8 U; d- h6 m4 q9.Dealing with low-power design constraints in an analog world
  i4 P5 o/ w5 ?3 i# M0 A10.Entering, tracking and verifying design intent between electrical and physical design
0 l# O/ o# e0 P5 Z! u8 O4 s11.Assessing parasitic sensitivities prior to full layout " i( k- G5 z7 Q: w  `
12.Optimizing circuit construction at 65nm and below . n3 k. {& c; e+ }- A% p! h) u' U
13.Techniques for design centering to achieve optimum performance / yield: C# W8 \5 W9 _1 E' m: r, o
14.Designing up to to six-sigma yield margins
# [6 P' |2 b' N! F) }$ k15.Other, please specify:
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