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發表於 2008-9-12 11:18:59
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ABCs of Probes
Table of Contents
7 T% J) r D% h* zProbes – The Critical Link To Measurement Quality . . . . . . . . .5& S' g, p% d# ^
What is a Probe? . . . . . .5
5 b% l% H2 z" i) TThe Ideal Probe . . . . . . .6" r, K$ q" f/ p1 T+ M ], k
The Realities of Probes . 7$ o8 L. l9 E. c' c
Choosing the Right Probe .10
! A, y2 E0 z5 I% J1 e" FSome Probing Tips . . . .11
9 D6 k. n6 i rSummary 12
$ p( ^# I2 D2 V% N' J" SDifferent Probes for Different Needs . . . . . . . . .13/ c0 ^' s, U" f( D7 N; {% M
Why So Many Probes? .13
) T- c. K+ n. b( l4 x3 l; _$ B4 {' lDifferent Probe Types and Their Benefits . . . . . . . .14
: z; |/ I7 W: @2 L1 iFloating Measurements .19
k2 Y+ V. z$ q7 DProbe Accessories . . . .20
4 {6 _4 F1 K; K7 U; u5 z3 f& SHow Probes Affect Your Measurements . . . . . . 22! a" R. x+ e# J$ @7 ?
The Effect of Source Impedance . . . . .228 g! _) q+ t/ }# X! D
Capacitive Loading . . . .22
" B Q! f! |$ hBandwidth Considerations 24+ B' {5 v s) r5 s
What To Do About Probing Effects . . . .289 I1 q6 Z% ?- |- t0 L* g5 I
Understanding Probe Specifications . . . . . . . .29
& y0 K" ~; I) DAberrations (universal) . 29& [' e7 z: K/ Y( ]
Amp-Second Product (current probes) .29
& a/ `+ m, N* _& EAttenuation Factor (universal) . . . . . . .29
0 S* ~9 y) x0 n( W" |9 n: BAccuracy (universal) . . .29
: { \' ?9 h; Z4 v" SBandwidth (universal) . .30
' q( m' Q8 K0 f" C4 zCapacitance (universal) .30
% x0 K% _/ u/ u! x8 O. k& Z5 OCMRR (differential probes) . . . . . . . . .302 J4 X4 i! o* p Z5 E
CW Frequency Current Derating (current probes) . . .31( q( d& |. e- ^) O4 s! r
Decay Time Constant (current probes) .31
! g, m% w& E! w" ZDirect Current (current probes) . . . . . .31
% q# v4 @ f/ W' Z, o) ]Insertion Impedance (current probes) . .316 `$ y l# X8 k4 n% r
Input Capacitance (universal) . . . . . . . .31
. s% ^( b; d7 Z/ S' V7 cInput Resistance (universal) . . . . . . . . .31
2 [7 L( f( D6 N5 Q) O+ O; a; vMaximum Input Current Rating (current probes) . . .31 |# V {9 t6 v# _% I
Maximum Peak Pulse Current Rating (current probes) .31
6 ], X& B X, t6 a) @( q" C) VMaximum Voltage Rating (universal) . . .31
' Z3 D) ]% ]& A7 HPropagation Delay (universal) . . . . . . .31
+ I$ s& v6 V8 `; v/ v0 jRise Time (universal) . .31* s$ n( n) n2 u" v/ U
Tangential Noise (active probes) . . . . .316 h& Z; e, Z5 H, B! u- `- F9 i
Temperature Range (universal) . . . . . .313 E1 a! T' D: N0 s2 a' }
A Guide to Probe Selection . . . . . . .320 }3 l6 g% F& {' A( J+ E8 b
Understanding the Signal Source . . . . .32
0 A7 J+ I+ O. ~/ \; V. F; pOscilloscope Issues . . .340 P! S/ F& U' `; V1 A) Q# u m
Selecting the Right Probe 35+ R* s, U5 g2 D/ k1 [! E
Advanced Probing Techniques . . . .36. c) v8 \& S6 X5 `9 ?( l: @
Ground Lead Issues . . .36
1 E! D8 b# ^: K& ]Differential Measurements . . . . . . . . .395 u1 v( a. c7 ?
Small Signal Measurements . . . . . . . . 42
; x. q2 H/ N; T$ ?Explanation of Safety Precautions .44
# V1 }- w: ^2 _ OObserve All Terminal Ratings . . . . . . . 44
4 h5 Y/ D; g" |% g* E: XUse Proper Grounding Procedures . . . .44
9 |& O8 ~) Q, k: y/ A" TConnect and Disconnect Probes Properly . . . . . . . .44
$ q" D; h$ E" lAvoid Exposed Circuitry . .455 T$ d" e* m, o9 `
Avoid RF Burns While Handling Probes .45! K& A W) a6 s6 U2 I6 A
Do Not Operate Without Covers . . . . . .45
c5 |* U9 A% d- y3 z7 n7 ?Do Not Operate in Wet/Damp Conditions . . . . . . . .45
# p; m" r2 w5 q( y( ^8 T; {Do Not Operate in an Explosive Atmosphere . . . . . .45) a9 ]1 k5 e2 R( o2 A/ W2 c
Do Not Operate with Suspected Failures . . . . . . . . .45" u! B$ Q6 D& |; q
Keep Probe Surfaces Clean and Dry . . .45
* p4 X6 p; J7 w* IDo Not Immerse Probes in Liquids . . . .45. O, S* _1 h. G$ n& Y2 ^
Glossary
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