一般大公司的PM最主要可以分成哪幾類呢？哪類最吃香？

heavy91

作者: allencho1131 (冰嵐) 看板: Tech_Job
標題: [請益] 關於PM問題請教
  A4 G/ h% V4 U8 I5 X時間: Sun Jun 17 23:30:29 2012

各位大大好:
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, j* j' c5 Z' O3 [幾個關於PM的問題想請教,謝謝
. f! v4 E9 Q7 R" A1. 想請問"產品的RD PM"和一般"產品PM"有什麼差別
# Q3 O" E# l6 L# A9 c   兩種職缺所需的background, 工作培養的skill及發展性是否有差
. l* h9 F! T; E- W! x; }2. 一般大公司的PM最主要可以分成哪幾類呢
4 c3 j8 @# k, c- w7 u3. 在品牌廠和代工廠當PM最主要會有什麼差別(以本土公司而言)
( l' v/ m2 T  V4. 在外商和本土公司的環境又有什麼差異呢? 外商似乎都收較資深的?
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ranica

招聘公司：top 500 IT products provider with famous brand of pc
招聘岗位：质量经理
- @# ?( J( R; T! _% O7 k工作地点：Beijing
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职位要求：
7 b& s2 y' Q) ?! M/ G  kB.E for EE or ME 3~5 years work experience in mobile phone industry Good experience for Telecommunication device function test and reliability test Goof skill for issue detection and analysis Skill for project / test plan control and communication for tasks

ranica

招聘公司：top 500 IT products provider with famous brand of pc
5 w/ q; S1 \6 ^) x0 X% M0 r% ?招聘岗位：软件产品经理
工作地点：Beijing
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0 z6 `1 \) I  z岗位描述：
软件项目开发流程与时程管理 软件功能规划、规格订定与实现管理 协调与沟通ODM、第三方与内部软件开发部门 第三方新技术研究与集成评估
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6 B# @- z" I) X职位要求：
5 R* R( c( E2 @$ i1 S8 Z& C5年以上工作经验 具备智能机软件项目管理经验 熟悉安卓OS发展与谷哥认证需求 具备良好沟通与协调技巧 具备同时管理多个项目能力 具备抗压能力与工作热诚

ranica

招聘公司：top 500 IT products provider with famous brand of pc
招聘岗位：ID/UI 设计
工作地点：Beijing

; r# X3 C  }( ]8 {岗位描述：
8 V5 j1 J0 v9 l2 l) Y; y手机, Tablet 平台上多媒体软件产品交互和视觉设计； 配合产品团队参与用户行为体验及提出创意方案； 根据交互定义和产品功能，完成图形及风格设计。

4 z2 Q" p1 z1 W* P$ \; h; U) V$ n职位要求：
两年以上的相关工作经验，大专以上学历； 熟练使用Photoshop、Illustrator 等主流图形处理软件； 熟悉图形界面设计方法和流程，对交互设计和用户体验有一定的了解； 有较强的学习能力和团队协作能力，善于沟通； 有Android手机软件设计经验或成功案例者优先 ； 英语书面表达，口语沟通能力较强者优先考虑； 请提供作品范例。

ranica

招聘公司：top Group purchase guidance
招聘岗位：无线产品经理
. l) Q( x% h. e# ]) ]* d3 J) U工作地点：Beijing

岗位描述：
6 ^  I& ]9 x3 L1 a1、负责团800无线产品功能设计与策略制定，并撰写产品需求文档（PRD）； 2、分析用户需求、竞争对手及市场方向，并撰写市场需求文档（MRD）； 3、控制项目周期，协调公司各合作部门，确保项目顺利进行； 4、与公司相关部门紧密配合，快速、高效推动产品设计、研发、运营及推广； 5、积极寻求改进团800无线产品的各种可能的思路和方案。
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职位要求：
; Z* ?* ?+ Z7 H  d2 B1、有2年以上产品管理经验，1年以上无线产品工作经验； 2、热衷于移动互联网，有丰富的各类无线产品使用经验，对移动互联网行业有深入的理解和洞察； 3、熟悉无线产品管理、研发及运营模式；具备手机客户端软件产品设计经验； 4、善于产品设计，对产品分析、数据分析、竞品分析等有见解； 5、团队合作意识强，沟通能力好，工作积极主动并有责任感，抗压能力较强。 6. 了解手机开发技术、无线技术、移动平台接入技术者优先。

ranica

职位要求：
Requirements:
1. BS/MS EE or related with 8+ years experience in semiconductor.
2. Verigy 93000, Teradyne J750 and Flex experiences as a plus.
3. Familiar with Wafer probe, Final test and Post test process as plus.
; d+ P6 K0 i) W: ^4. Foundry process experience as a plus.
  G) ~  c% x6 \  m/ F9 ^- A2 B5. Good test methodology knowledge such as DFT (scan stuck at and transition delay) for high speed digital, mixed signal or RF as a plus.
( u3 H7 H" m! }" {7 w6. Quality & Reliability study experience (HTOL, ESD, and Latch-up) as a plus.
( q! m* t: d2 G' \2 \7. Good Failure Analysis knowledge with generic knowledge of assembly
8. Good computer skills required and knowledge of Dataconductor Syntricity, YDI , Genesis ,Galaxy or Data power as a plus for test data management. 9. Rich Experience in relevant product test development, hardware engineering and product characterization.
2 G5 ~4 `9 v8 Y5 Y2 L5 i10. Strong C, C++ , VB and Perl program experience in windows and unix base as plus.
- d( K. ~2 v. }! w- ]' o, C11. Good Sense on Quality Control
! S0 u% l1 Y& p* U12. Good communication skills on both fluent oral and written English are must.

ranica

招聘公司：A famous IC company
招聘岗位：Senior Product Engineer
. W# d( C& k; j% R4 a工作地点：Shanghai
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岗位描述：
Responsibilities: 1. Review technical product requirements in order to develop a comprehensive manufacturing plan. 2. Define Characterization plan and perform Characterization for the products on the design expectations until production relese. 3. Support test development and Characterize new products with Test Engineering Team on major test plateforms like Verigy 93K, Teradyne J750, Teradyne Flex testers for high speed digitial, mixed signal or RF products testing and become the general technical expert on the product. 4. Support the implementation of prototypes by colabroatively working with design & manufactuirng partners in the execution of the manufacturing plan. 5. Act as the technical liaisons between design, assembly, test and operations on new product introductions. 6. Support the transfer of new prototype products to volume manufacturing. 7. Reduce product cost through continuous improvements in yield & throughput of the foundry, assembly & test areas. Troubleshoot production failures and perform root cause analysis. 8. Support manfuacturing to resolve low yield and testing issue with strong testing and debuging experience with gloable offsore test house. 9. Work with Fab process technical engineer to fix issue on foundry. 10. Handle RMA material and update team on the results and determine root cause of failure. 11. Maintain Yield data and perform correlations to improve yield. 12. Manage changes through Engineering change Notices (ECS's) and customer acknowledgements.