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What Custom IC Design Challenges are you facing now?

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發表於 2007-11-12 17:38:00 | 只看該作者 回帖獎勵 |正序瀏覽 |閱讀模式
Please select the following issues that you believe EDA Tool Vendors should invest in based on your experience and design needs. :o & V5 |% P/ a/ j" g2 G
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Add your comments to further explain how these issues are impacting your design process. And let's discuss these before 2008.
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) a3 B# {( K4 g2 Q8 Y1.Time and schedule
7 C# W- m, ^, |! [2.Parallel designs e.g. layout and design engineering working at the same time- L) a+ K- T( m; N$ S
3.DRC/LVS/ANT verification
' h( a+ T  J0 P5 _4.DFT* F" \* l- J' l. M5 N: V
5.Working in a multi user environment
  j# m7 I, p# _2 v. k6.Incorporating latest process node specifics (e.g. .65, .45 CMOS)
" r2 o$ v1 Y' J/ Q: w# m! J7.More than Moore technologies, such as high voltage design, high frequency design, high current design, high temperature design, multiple   
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   technology support in a single design, Mems
/ e8 B" V' T. K  }  c, d) W/ T8.Incorporating RF blocks into standard designs (RF SoC Design)& ?/ X* S( {& f: Q. x
9.Dealing with low-power design constraints in an analog world' u) c; c, d# D9 h) O% C3 w
10.Entering, tracking and verifying design intent between electrical and physical design
- b5 N, l; ]( X11.Assessing parasitic sensitivities prior to full layout
/ v9 I% f' H' J12.Optimizing circuit construction at 65nm and below 7 j6 w% d* x) S
13.Techniques for design centering to achieve optimum performance / yield' u; ^$ T* H8 A: T; Q
14.Designing up to to six-sigma yield margins
6 l3 ?( j% o4 `9 w15.Other, please specify:
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