請問在畫IC佈局時~有哪些問題需要考慮的~

vadj

請問在畫IC佈局時~有哪些問題需要考慮的~
例如天線效應、對稱性、latchu
' [9 Z( ?7 `5 N9 d0 s4 k請問還有些什麼呢？
& A* z' A& J/ ~) H2 hPS 先不管是畫什麼電路，就請先說一些基本一定會考量到的問題。謝謝

yoyo20701

唷~~~~我終於了解囉~~~~謝謝大大講解唷~~~謝謝~~你

bjic

问客户，做客户想要的。也就是前端工程师
! y2 n8 ~+ r. T当然有时候还要凭自己的经验判断。

billionwong

1. Chip size. You need to know what kinds of package will be used.
: ~! s* D# j! S& b2 D( l2 I2 Y* ^3 i2. Pad location. You need to confirm with supplier about the bond wire bonding.
  h; y3 B1 [" T3 O# K+ `- m( i3. ESD and latchup consideration.
2 b- C+ [% a" s% F( X# A: z4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path.
8 w! D( x' G# q9 a+ W3 h  ?5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit.
+ k3 y8 D$ T  A$ g, h: d( x# t6. Make sure there is no softcon connection.
7. How many metal layers could be used ?
8. Metal Density consideration.

小朱仔

很重要的一點
耐電流
每條走線的耐電流
I/O Pad的電流
+ c  y7 h; y6 D2 A9 ]( eIR Drop
" a' ]4 k5 Z- y6 ]2 M- \) iMatching
6 O. C! Y$ b1 F& H/ `
; p3 |0 r: S0 q4 M! ~3 setc....