標題: MEMS bonding process development engineer [打印本頁] 作者: ranica 時間: 2011-9-22 03:31 PM 標題: MEMS bonding process development engineer 招聘公司：A semiconductor technology development company3 v4 I) o7 Q j ]) [
招聘岗位：MEMS BONDING PROCESS DEVELOPMENT ENGINEER ' Q/ z) ^: @/ A" r工作地点：Wuxi; I/ r8 ?, [$ u( n' h& h. T
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Key Tasks/Duties/Responsibilities of this Position: – This position will implement wafer bonding technology integration know how for Micro Electrical Mechanical Systems (MEMS) applications i.e. accelerometers, gyros, print heads, pressure sensors, etc. and will define process flow based on customer requirements. Responsibilities: – Implement wafer bonding solutions for a wide variety of materials. – Create and support pretreatment, activation, and bond processes needed by customers and insure that these processes are stable and effective. – Use IR, acoustic methods, as well as other metrology techniques to evaluate bond quality. – Utilize SPC monitoring to control processes within the area to target levels as defined by customer goals. Insure that the correct SPC metrics are being tracked. – Troubleshoot process interaction issues on developmental and customer processes to insure compatibility. – Assist in the development of new and novel MEMS technologies. – Work with customers on novel material integration and develop solutions. – Develop and communicate/present technical material作者: ranica 時間: 2011-9-22 03:31 PM
职位要求： ' V1 o: @, L+ w. iKnowledge/Skills/Training Required to be Successful: – B.S. Degree in Engineering, Chemistry, Physics or Material Science. MS/PhD preferred. – 5+ years experience as process engineer in a semiconductor/MEMS wafer fab. – Must have excellent knowledge of bonding/MEMS processing. – Knowledge of statistical process control and statistically designed experiments. – Excellent written and oral skills required. – Must be fluent in verbal and written English and Mandarin. Other Requirements: – Requires in-depth, hands-on knowledge and experience of wafer bonding processes. – Experience developing wafer bonding processes and other MEMS process modules and maturing those processes for manufacturing. – Communicate and work with customers in solving difficult technical problems. – Requires strong responsiveness in a manufacturing environment, strong technical team direction skills, good data analysis/statistics skills. – Requires ability to design and conduct DOEs to develop and optimize pretreatment, activation, and wafer bonding techniques. – Must understand SPC and other fab quality systems. – Requires interface with all levels of management within company and customer organization as well as key managers and directors of specific projects. – Experience in Si Etch processing and wet processing for MEMS applications. – Experience leading technical projects. – Must have Microsoft Office experience. – Must be able to travel and train in the United States for up to three months. Pluses: – Knowledge of Litho, Films, Etch and Metals. – Process know-how for fabrication of MEMS devices. – Technology transfer experience to high volume manufacturing. – Experience working with external customers on successful completion of engineering projects. Special Physical Requirements or Restrictions: – Able to work in semiconductor fab environment: ability to stoop, kneel, bend in full clean room suit; safety glasses and ear plugs may be required.