標題: SiP未來的出路 [打印本頁] 作者: newstudent 時間: 2009-7-17 09:35 PM 標題: SiP未來的出路 SiP未來的出路如何？1 j e3 R. T6 G: p2 m
沒有前段IC設計的經驗,只有後段封裝經驗,和RF component設計經驗,# v$ W% t0 K- ~1 k4 U2 g; @" f/ Q" Y
沒有整個系統的概念,如何切入做SiP?作者: ychchip 時間: 2009-7-17 10:44 PM
SiP is useful to high density package, especially for a system integration./ {9 K) D8 C' m' p# \6 C- ?" t7 J8 k
maybe it becomes more important technology recently. however, the potential in future sound compatiable with 3-D IC. Recently, It becomes a focus point in eduation of Taiwan. More universioties had the relative class.