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1. Chip size. You need to know what kinds of package will be used.+ m- a5 G8 R y9 ]% \
2. Pad location. You need to confirm with supplier about the bond wire bonding.
~; \* n4 J, m" e4 a3. ESD and latchup consideration.
5 W% m' t, M8 ]- B4 ~8 w4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path., Y6 Z8 A2 b, G1 N2 E
5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit.
9 j. n# W/ B6 B7 k3 @7 Y6. Make sure there is no softcon connection.' J5 B$ q8 J1 y
7. How many metal layers could be used ?
: z. s* w8 N8 [) p% n/ N! M& O8. Metal Density consideration. |
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